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Contents

README

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BZX84C16S-7-F

Diodes Incorporated · Zener Diodes · SOT-363

BZX84C16S-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection; shown as NC at the bottom-left of the top-view device schematic.
2 A2 passive Anode of Zener diode 2, bottom middle of the top-view schematic.
3 C2 passive Cathode of Zener diode 2 (16V nominal, 15.3-17.1V at IZT = 5mA), bottom right of the top-view schematic.
4 NC unconnected No connection; shown as NC at the top-right of the top-view device schematic.
5 A1 passive Anode of Zener diode 1, top middle of the top-view schematic.
6 C1 passive Cathode of Zener diode 1 (16V nominal, 15.3-17.1V at IZT = 5mA), top left of the top-view schematic.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 15.3 16 17.1 V IZT = 5.0mA, TA = 25°C 2
Test Current IZT 5 mA TA = 25°C 2
Maximum Zener Impedance ZZT 40 Ω @ IZT = 5.0mA, f = 1KHz 2
Maximum Zener Knee Impedance ZZK 200 Ω @ IZK = 1.0mA, f = 1KHz 2
Maximum Reverse Current IR 0.1 uA VR = 11.2V 2
Temperature Coefficient of Zener Voltage 10.4 14 mV/°C @ IZT = 5mA 2
Forward Voltage VF 0.9 V IF = 10mA, TA = 25°C 1
Power Dissipation PD 200 mW Mounted on FR4 PC Board with recommended pad layout (Note 1) 1
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 1
Thermal Resistance, Junction to Ambient Air RθJA 625 °C/W Mounted on FR4 PC Board with recommended pad layout (Note 1) 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 1

CAD (KiCad official)

  • Symbol: BZX84C16S-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: bzx84c16s-7-f-etched.step / bzx84c16s-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c16s-7-f.step / bzx84c16s-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 20ba77a2a153b024, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF