component
BSD3C181V
Public Made by Adomby adom
BORN ESD And Surge Protection (TVS/ESD), SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownBSD3C181V
BORN · ESD And Surge Protection (TVS/ESD) · SOD-323
BSD3C181V from BORN, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Bidirectional ESD protection diode terminal (reverse stand-off 18.0V, clamping voltage 40V max at IPP=5.5A, 8/20μs); polarity-independent with pin 2. |
| 2 | 2 | passive | Bidirectional ESD protection diode terminal (reverse stand-off 18.0V, clamping voltage 40V max at IPP=5.5A, 8/20μs); polarity-independent with pin 1. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VRWM | 18 | V | 2 | |||
| Reverse Breakdown Voltage | VBR | 19.8 | V | IT=1mA | 2 | ||
| Reverse Leakage Current | IR | 0.5 | uA | VRWM=18V,T=25℃ | 2 | ||
| Clamping Voltage | VC | 40 | V | IPP=5.5A,tp=8/20μs | 2 | ||
| Junction Capacitance | Cj | 12 | pF | VR = 0V, f =1MHz | 2 | ||
| Peak Pulse Power | PPP | 220 | Watts | tp =8/20μs | 2 | ||
| Peak Pulse Current | Ipp | 5.5 | A | tp =8/20μs | 2 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | 30 | kV | IEC 61000-4-2 Air | 2 | ||
| ESD per IEC 61000-4-2 (Contact) | VESD | 30 | kV | IEC 61000-4-2 Contact | 2 | ||
| Lead Soldering Temperature | TL | 260 | ℃ | 10 seconds | 2 | ||
| Junction Temperature | TJ | -55 | 150 | ℃ | 2 | ||
| Storage Temperature | Tstg | -55 | 150 | ℃ | 2 |
CAD (KiCad official)
- Symbol:
BSD3C181V - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
bsd3c181v-etched.step/bsd3c181v-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bsd3c181v.step/bsd3c181v.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (4 pp, sha256
6ac35e748c1826bd, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).