component
W25Q64FWSSIQ
Public Made by Adomby adom
Winbond Elec NOR FLASH, SOIC-8-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownW25Q64FWSSIQ
Winbond Elec · NOR FLASH · SOIC-8-208mil
W25Q64FWSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /CS | input | Chip Select input; when high the device is deselected and DO/IO pins are high impedance, and /CS must track VCC at power-up and power-down. |
| 2 | DO (IO1) | bidirectional | Serial Data Output (IO1 in Dual/Quad SPI and QPI modes), data is read on the falling edge of CLK and the pin is high impedance when /CS is high. |
| 3 | /WP (IO2) | bidirectional | Active-low Write Protect input for Status Register protection in Standard/Dual SPI, which becomes IO2 when QE=1 and the /WP function is then unavailable. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | DI (IO0) | bidirectional | Serial Data Input (IO0 in Dual/Quad SPI and QPI modes), data is written on the rising edge of CLK. |
| 6 | CLK | input | Serial Clock input providing the timing for serial input and output operations. |
| 7 | /HOLD or /RESET (IO3) | bidirectional | Active-low Hold input that pauses operation while selected when QE=0 and HOLD/RST=0; it can be configured as /RESET (HOLD/RST=1) or becomes IO3 when QE=1, with /HOLD and /RESET then disabled. |
| 8 | VCC | power_in | Power supply input; the device operates on a single 1.65V to 1.95V supply. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-8-208mil |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (storage/absolute, lower bound) | VCC | -0.6 | V | Printed range -0.6 to VCC+0.6 V; upper bound is VCC-relative | 78 | ||
| Voltage Applied to Any Pin (lower bound) | VIO | -0.6 | V | Relative to Ground; printed range -0.6 to VCC+0.6 V | 78 | ||
| Transient Voltage on any Pin (lower bound) | VIOT | -1 | V | <20nS transient relative to ground; printed range -1.0V to VCC+1.0V | 78 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 78 | ||
| Electrostatic Discharge Voltage | VESD | -2000 | 2000 | V | Human Body Model | 78 | |
| Supply Voltage | VCC | 1.65 | 1.95 | V | FR = 104MHz, fR = 50MHz | 78 | |
| Ambient Temperature, Operating (Industrial) | TA | -40 | 85 | °C | Industrial | 78 | |
| Write Inhibit Threshold Voltage | VWI | 1 | 1.4 | V | Characterized only | 79 | |
| Input Leakage Current | ILI | -2 | 2 | µA | 80 | ||
| I/O Leakage Current | ILO | -2 | 2 | µA | 80 | ||
| Input Low Voltage (lower bound) | VIL | -0.5 | V | Printed upper bound VCC x 0.3 V (VCC-relative) | 80 | ||
| Standby Current | ICC1 | 10 | 50 | µA | /CS = VCC, VIN = GND or VCC | 80 | |
| Power-down Current | ICC2 | 1 | 20 | µA | /CS = VCC, VIN = GND or VCC | 80 | |
| Current Write Status Register | ICC4 | 8 | 12 | mA | /CS = VCC | 80 | |
| Current Page Program | ICC5 | 20 | 25 | mA | /CS = VCC | 80 | |
| Current Sector/Block Erase | ICC6 | 20 | 25 | mA | /CS = VCC | 80 | |
| Current Chip Erase | ICC7 | 20 | 25 | mA | /CS = VCC | 80 | |
| Clock frequency for all other instructions except 6Bh, BBh, E7h, E3h | FR | 104 | MHz | Lower bound printed as D.C. | 82 | ||
| Clock frequency for 6Bh, BBh instructions | FR | 80 | MHz | Lower bound printed as D.C. | 82 | ||
| Clock frequency for Read Data instruction (03h) | fR | 50 | MHz | Lower bound printed as D.C. | 82 | ||
| Write Status Register Time | tW | 10 | 25 | ms | 82 | ||
| Byte Program Time (First Byte) | tBP1 | 30 | 60 | µs | 82 | ||
| Additional Byte Program Time (After First Byte) | tBP2 | 2.5 | 12 | µs | 82 | ||
| Page Program Time | tPP | 0.7 | 5 | ms | 82 | ||
| Sector Erase Time (4KB) | tSE | 100 | 400 | ms | 82 | ||
| Block Erase Time (32KB) | tBE1 | 120 | 1600 | ms | 82 | ||
| Block Erase Time (64KB) | tBE2 | 150 | 2000 | ms | 82 | ||
| Chip Erase Time | tCE | 20 | 100 | s | 82 |
CAD (KiCad official)
- Symbol:
W25Q64FWSSIQ - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
- 3D model files:
w25q64fwssiq-etched.step/w25q64fwssiq-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);w25q64fwssiq.step/w25q64fwssiq.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (93 pp, sha256
1d8cc8f9ebb940ed, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).