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Contents

README

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TPS54110PWPR

Texas Instruments · DC-DC Converters · HTSSOP-20-EP

TPS54110PWPR from Texas Instruments, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AGND power_in Analog ground, internally connected to the sensitive analog-ground circuitry; connect to PGND and the PowerPAD.
2 VSENSE input Error amplifier inverting input; absolute maximum voltage range on this pin is -0.3 V to 4 V.
3 COMP output Error amplifier output; connect the compensation network from COMP to VSENSE. Absolute maximum sink current is 6 mA.
4 PWRGD output Power-good open-drain output that is high when VSENSE is at or above 93% of Vref and low otherwise; it is also low when SS/ENA is low or internal shutdown is active, with a maximum sink current of 10 mA.
5 BOOT input Bootstrap input; a 0.022-µF to 0.1-µF low-ESR capacitor connected from BOOT to PH generates the floating drive for the high-side FET driver.
6 PH bidirectional Phase input/output at the junction of the internal high- and low-side power MOSFETs and the output inductor; absolute maximum sink current is 3.5 A.
7 PH bidirectional Phase input/output at the junction of the internal high- and low-side power MOSFETs and the output inductor; absolute maximum sink current is 3.5 A.
8 PH bidirectional Phase input/output at the junction of the internal high- and low-side power MOSFETs and the output inductor; absolute maximum sink current is 3.5 A.
9 PH bidirectional Phase input/output at the junction of the internal high- and low-side power MOSFETs and the output inductor; absolute maximum sink current is 3.5 A.
10 PH bidirectional Phase input/output at the junction of the internal high- and low-side power MOSFETs and the output inductor; absolute maximum sink current is 3.5 A.
11 PGND power_in Power ground and high-current return for the low-side driver and power MOSFET; connect with large copper areas to the input and output supply returns, AGND, and the PowerPAD.
12 PGND power_in Power ground and high-current return for the low-side driver and power MOSFET; connect with large copper areas to the input and output supply returns, AGND, and the PowerPAD.
13 PGND power_in Power ground and high-current return for the low-side driver and power MOSFET; connect with large copper areas to the input and output supply returns, AGND, and the PowerPAD.
14 VIN power_in Input supply for the power MOSFET switches and internal bias regulator; recommended operating input range is 3 V to 6 V, bypassed to PGND with a 1-µF to 10-µF low-ESR ceramic capacitor.
15 VIN power_in Input supply for the power MOSFET switches and internal bias regulator; recommended operating input range is 3 V to 6 V, bypassed to PGND with a 1-µF to 10-µF low-ESR ceramic capacitor.
16 VIN power_in Input supply for the power MOSFET switches and internal bias regulator; recommended operating input range is 3 V to 6 V, bypassed to PGND with a 1-µF to 10-µF low-ESR ceramic capacitor.
17 VBIAS power_out Internal bias regulator output supplying internal circuitry; bypass to AGND with a 0.1-µF to 1-µF high-quality, low-ESR ceramic capacitor.
18 SS/ENA bidirectional Slow-start/enable pin that acts as a logic input to enable or disable device operation and as a capacitor input to externally set the start-up time; absolute maximum sink current is 10 mA.
19 SYNC input Synchronization input that synchronizes to an external oscillator or selects between two internally set switching frequencies; when synchronizing externally, a resistor must be connected to RT.
20 RT input Frequency-setting resistor input; connect a resistor from RT to AGND to set the switching frequency fs (absolute maximum range -0.3 V to 6 V).
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-20-EP
Category Power Supply Chip
Pins 21

CAD (KiCad official)

  • Symbol: TPS54110PWPR
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tps54110pwpr-etched.step / tps54110pwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps54110pwpr.step / tps54110pwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (37 pp, sha256 36399588e3462175, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF