component
11AA010T-I
Public Made by Adomby adom
Microchip Tech EEPROM, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdown11AA010T-I
Microchip Tech · EEPROM · SOT-23
11AA010T-I from Microchip Tech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SCIO | bidirectional | Serial clock and data input/output pin used to transfer commands, addresses and data, with the clock embedded via Manchester encoding (each bit has a transition at the middle of the bit period). |
| 2 | VCC | power_in | Supply voltage; the 11AA010 operates from 1.8V to 5.5V (I-temp, -40°C to +85°C). |
| 3 | VSS | power_in | Ground reference for the device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOT-23 |
| Category | Memory |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (11AA010 device range) | VCC | 1.8 | 5.5 | V | 2 | ||
| Ambient temperature, Industrial (I) | -40 | 85 | °C | VCC = 2.5V to 5.5V | 3 | ||
| Ambient temperature, Industrial (I) | -20 | 85 | °C | VCC = 1.8V to 2.5V | 3 | ||
| SCIO w.r.t. VSS | -0.6 | V | w.r.t. VSS | 3 | |||
| Storage temperature | -65 | 150 | °C | 3 | |||
| Ambient temperature under bias | -40 | 125 | °C | 3 | |||
| ESD protection on all pins | 4 | kV | 3 | ||||
| Low-level input voltage | VIL | -0.3 | V | VCC ≥ 2.5V | 3 | ||
| Low-level output voltage | VOL | 0.4 | V | IOI = 300 A, VCC = 5.5V | 3 | ||
| Output current limit | IO | -4 | 4 | mA | VCC = 5.5V (Note 1) | 3 | |
| Output current limit | IO | -3 | 3 | mA | Vcc = 2.5V (Note 1) | 3 | |
| Input leakage current (SCIO) | ILI | -1 | 1 | µA | VIN = VSS or VCC | 3 | |
| Internal capacitance (all inputs and outputs) | CINT | 7 | pF | TA = 25°C, FCLK = 1 MHz, VCC = 5.0V (Note 1) | 3 | ||
| Read operating current | ICC Read | 3 | mA | VCC=5.5V; FBUS=100 kHz, CB=100 pF | 3 | ||
| Read operating current | ICC Read | 1 | mA | VCC=2.5V; FBUS=100 kHz, CB=100 pF | 3 | ||
| Write operating current | ICC Write | 5 | mA | VCC = 5.5V | 3 | ||
| Write operating current | ICC Write | 3 | mA | VCC = 2.5V | 3 | ||
| Standby current | Iccs | 1 | µA | VCC = 5.5V, TA = 85°C | 3 | ||
| Idle mode current | ICCI | 50 | µA | VCC = 5.5V | 3 | ||
| Serial bus frequency | FBUS | 10 | 100 | kHz | 4 | ||
| Bit period | TE | 10 | 100 | µs | 4 | ||
| Input edge jitter tolerance | TIJIT | -0.06 | 0.06 | UI | (Note 3) | 4 | |
| Serial bus frequency drift rate tolerance | FDRIFT | -0.5 | 0.5 | % per byte | 4 | ||
| Serial bus frequency drift limit | FDEV | -5 | 5 | % per command | 4 | ||
| Output edge jitter | TOJIT | -0.25 | 0.25 | UI | (Note 3) | 4 | |
| SCIO input rise time | TR | 100 | ns | 4 | |||
| SCIO input fall time | TF | 100 | ns | 4 | |||
| Standby pulse time | TSTBY | 600 | µs | 4 | |||
| Start header setup time | TSS | 10 | µs | 4 | |||
| Start header low pulse time | THDR | 5 | µs | 4 | |||
| Input filter spike suppression (SCIO) | TSP | 50 | ns | 4 | |||
| Write cycle time (byte or page) | TWC | 5 | ms | Write, WRSR commands | 4 | ||
| Write cycle time (ERAL/SETAL) | TWC | 10 | ms | ERAL, SETAL commands | 4 | ||
| Endurance (per page) | 1 | M cycles | 25°C, VCC = 5.5V (Note 2) | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Package: P = 8-lead Plastic DIP (300 mil body) SN = 8-lead Plastic SOIC (3.90 mm body) | 45 |
CAD (KiCad official)
- Symbol:
11AA010T-I - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
11aa010t-i-etched.step/11aa010t-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);11aa010t-i.step/11aa010t-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (48 pp, sha256
f656c4e768926793, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).