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Contents

README

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DMP10H4D2S-7

Diodes Incorporated · MOSFETs · SOT-23

DMP10H4D2S-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; ESD protected up to 2kV HBM via an internal gate protection diode, VGSS rated ±20V, threshold -1.0V to -3.0V.
2 S passive Source of the P-channel MOSFET; body diode continuous current IS is -0.27A.
3 D passive Drain; VDSS -100V, continuous drain current -0.27A at TA = +25°C and pulsed -1.0A.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -100 V VGS = 0V, ID = -250µA 3
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -100V, VGS = 0V 3
Gate-Body Leakage IGSS -10 10 μA VGS = ±20V, VDS = 0V 3
Gate Threshold Voltage VGS(TH) -1 -2.3 -3 V VDS = VGS, ID = -250µA 3
Static Drain-Source On-Resistance RDS(ON) 2.8 4.2 Ω VGS = -10V, ID = -0.5A 3
Static Drain-Source On-Resistance RDS(ON) 3.2 5 Ω VGS = -4.0V, ID = -0.1A 3
Diode Forward Voltage VSD -0.82 -1.3 V VGS = 0V, IS = -0.2A 3
Drain-Source Voltage VDSS -100 V 2
Gate-Source Voltage VGSS -20 20 V 2
Continuous Drain Current (steady state) ID -0.27 A VGS = -10V, TA = +25°C 2
Continuous Drain Current ID -0.21 A VGS = -10V, TA = +70°C 2
Pulsed Drain Current IDM -1 A 10μs pulse, duty cycle 1% 2
Maximum Body Diode Continuous Current IS -0.27 A Note 6 2
Total Power Dissipation PD 0.38 W (Note 6) as printed; see review_required 2
Total Power Dissipation PD 0.44 W Note assignment unclear in text; see review_required 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Thermal Resistance, Junction to Ambient (steady state) RθJA 333 °C/W Steady state, Note 5 (FR-4, minimum recommended pad layout, single sided) 2
Thermal Resistance, Junction to Ambient RθJA 282 °C/W Note 6 (FR-4, 2oz copper, 1inch square pad) 2
Thermal Resistance, Junction to Case RθJC 115 °C/W Note 6 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe. Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: DMP10H4D2S-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: dmp10h4d2s-7-etched.step / dmp10h4d2s-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmp10h4d2s-7.step / dmp10h4d2s-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (8 pp, sha256 66a9f09393e31950, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF