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GD25Q127CFIGR

Public Made by Adom

by adom

GigaDevice Semicon Beijing NOR FLASH, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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GD25Q127CFIGR

GigaDevice Semicon Beijing · NOR FLASH · SOIC-16-300mil

GD25Q127CFIGR from GigaDevice Semicon Beijing, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 HOLD#/RESET#(IO3) bidirectional Hold or Reset input, also Data Input Output 3 (IO3) in Quad SPI mode; HOLD# is available only when QE=0.
2 VCC power_in Power supply, 2.7 to 3.6V operating range.
3 NC unconnected No connect; on special order only, this pin is RESET#.
4 NC unconnected No connect.
5 NC unconnected No connect.
6 NC unconnected No connect.
7 CS# input Chip Select input; must be driven high when the chip is not selected and must not be left floating after power-on.
8 SO(IO1) bidirectional Data output (Data Input Output 1).
9 WP#(IO2) bidirectional Write Protect input, also Data Input Output 2 (IO2) in Quad SPI mode.
10 VSS power_in Ground.
11 NC unconnected No connect.
12 NC unconnected No connect.
13 NC unconnected No connect.
14 NC unconnected No connect.
15 SI(IO0) bidirectional Data input (Data Input Output 0).
16 SCLK input Serial Clock input.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package SOIC-16-300mil
Category Memory
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature -40 85 ℃ 45
Storage Temperature -65 150 ℃ 45
VCC Supply Voltage (absolute maximum) VCC -0.6 4.2 V 45
Applied Input/Output Voltage -0.6 V max printed as VCC+0.4 45
Transient Input/Output Voltage (overshoot) -2 V overshoot; max printed as VCC+2.0 45
Supply Voltage VCC 2.7 3.6 V T=-40℃~85℃, Normal Mode 47
VCC (min) To CS# Low tVSL 2.5 ms 45
Write Inhibit Voltage VWI 1.5 2.5 V 45
Input Leakage Current ILI -2 2 μA T=-40℃85℃, VCC=2.73.6V, Normal Mode 47
Output Leakage Current ILO -2 2 μA T=-40℃85℃, VCC=2.73.6V, Normal Mode 47
Standby Current ICC1 20 50 μA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CS#=VCC, VIN=VCC or VSS 47
Deep Power-Down Current ICC2 1 5 μA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CS#=VCC, VIN=VCC or VSS 47
Operating Current (Read) ICC3 15 20 mA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CLK=0.1VCC/0.9VCC at 104MHz, Q=Open 47
Operating Current (Read) ICC3 13 18 mA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CLK=0.1VCC/0.9VCC at 80MHz, Q=Open 47
Operating Current (PP) ICC4 27 mA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CS#=VCC 47
Operating Current (WRSR) ICC5 27 mA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CS#=VCC 47
Operating Current (SE) ICC6 27 mA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CS#=VCC 47
Operating Current (BE) ICC7 27 mA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CS#=VCC 47
Operating Current (CE) ICC8 27 mA T=-40℃85℃, VCC=2.73.6V, Normal Mode; CS#=VCC 47
Output Low Voltage VOL 0.2 V T=-40℃85℃, VCC=2.73.6V, Normal Mode; IOL=100μA 47
Serial Clock Frequency For Fast Read (0BH) FC 104 MHz CL=30pF, Normal Mode, -40℃~85℃, 2.7-3.6V supply 53
Serial Clock Frequency For Dual/Quad Output, Dual/Quad I/O, Quad I/O Word Fast Read on 2.7-3.0V fC1 80 MHz CL=30pF, Normal Mode, -40℃~85℃, on 2.7V-3.0V power supply 53
Serial Clock Frequency For Dual/Quad Output, Dual/Quad I/O, Quad I/O Word Fast Read on 3.0-3.6V fC2 104 MHz CL=30pF, Normal Mode, -40℃~85℃, on 3.0V-3.6V power supply 53
Serial Clock Frequency For Read (03H), Read Manufacturer ID/Device ID (90H), Read Identification (9FH) fR 80 MHz CL=30pF, Normal Mode, -40℃~85℃ 53
Serial Clock High Time tCLH 4.5 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Serial Clock Low Time tCLL 4.5 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Serial Clock Rise Time (Slew Rate) tCLCH 0.1 V/ns CL=30pF, Normal Mode, -40℃~85℃ 53
Serial Clock Fall Time (Slew Rate) tCHCL 0.1 V/ns CL=30pF, Normal Mode, -40℃~85℃ 53
CS# Active Setup Time tSLCH 5 ns CL=30pF, Normal Mode, -40℃~85℃ 53
CS# Active Hold Time tCHSH 5 ns CL=30pF, Normal Mode, -40℃~85℃ 53
CS# Not Active Setup Time tSHCH 5 ns CL=30pF, Normal Mode, -40℃~85℃ 53
CS# Not Active Hold Time tCHSL 5 ns CL=30pF, Normal Mode, -40℃~85℃ 53
CS# High Time (Read/Write) tSHSL 20 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Output Disable Time tSHQZ 6 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Output Hold Time tCLQX 1 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Data In Setup Time tDVCH 2 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Data In Hold Time tCHDX 2 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Clock Low To Output Valid tCLQV 6.5 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Write Protect Setup Time Before CS# Low tWHSL 20 ns CL=30pF, Normal Mode, -40℃~85℃ 53
Write Protect Hold Time After CS# High tSHWL 100 ns CL=30pF, Normal Mode, -40℃~85℃ 53
CS# High To Deep Power-Down Mode tDP 20 μs CL=30pF, Normal Mode, -40℃~85℃ 53
CS# High To Standby Mode Without Electronic Signature Read tRES1 30 μs CL=30pF, Normal Mode, -40℃~85℃ 53
CS# High To Standby Mode With Electronic Signature Read tRES2 30 μs CL=30pF, Normal Mode, -40℃~85℃ 53
CS# High To Next Command After Suspend tSUS 20 μs CL=30pF, Normal Mode, -40℃~85℃ 53
Latency Between Resume And Next Suspend tRS 100 μs CL=30pF, Normal Mode, -40℃~85℃ 53
CS# High To Next Command After Reset (Except From Erase) tRST 30 μs CL=30pF, Normal Mode, -40℃~85℃ 54
CS# High To Next Command After Reset (From Erase) tRST_E 12 ms CL=30pF, Normal Mode, -40℃~85℃ 54
Write Status Register Cycle Time tW 5 30 ms CL=30pF, Normal Mode, -40℃~85℃ 54
Byte Program Time (First Byte) tBP1 30 50 μs CL=30pF, Normal Mode, -40℃~85℃ 54
Additional Byte Program Time (After First Byte) tBP2 2.5 12 μs CL=30pF, Normal Mode, -40℃~85℃ 54
Page Programming Time tPP 0.5 2.4 ms CL=30pF, Normal Mode, -40℃~85℃ 54
Sector Erase Time tSE 50 400 ms CL=30pF, Normal Mode, -40℃~85℃ 54
Block Erase Time (32K Bytes) tBE1 0.16 0.8 s CL=30pF, Normal Mode, -40℃~85℃ 54
Block Erase Time (64K Bytes) tBE2 0.3 1.2 s CL=30pF, Normal Mode, -40℃~85℃ 54
Chip Erase Time (GD25Q127C) tCE 50 120 s CL=30pF, Normal Mode, -40℃~85℃ 54
Reset Pulse Width tRLRH 1 μs 66
Reset High Time Before Read tRHSL 50 ns 66
Reset Recovery Time tRB 12 ms 66

CAD (KiCad official)

  • Symbol: GD25Q127CFIGR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: gd25q127cfigr-etched.step / gd25q127cfigr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd25q127cfigr.step / gd25q127cfigr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (79 pp, sha256 16c445635a0442a5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF