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Contents

README

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C8051F300-GMR

SILICON LABS · SILICON LABS · WSON-10-EP(3x3)

C8051F300-GMR from SILICON LABS, in a WSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VREF/P0.0 power_in External voltage reference input or Port 0.0, a digital I/O or analog input.
2 P0.1 bidirectional Port 0.1, a digital I/O or analog input.
3 VDD power_in Power supply voltage, 2.7 to 3.6 V.
4 XTAL1/P0.2 bidirectional Analog-input crystal pin that is the external oscillator circuit return for a crystal or ceramic resonator, or Port 0.2 as a digital I/O or analog input.
5 XTAL2/P0.3 bidirectional Crystal excitation driver (analog output) or external clock input for CMOS, capacitor or RC configurations, or Port 0.3 as a digital I/O.
6 P0.4 bidirectional Port 0.4, a digital I/O or analog input; UART TX0 is always assigned to this pin when selected.
7 P0.5 bidirectional Port 0.5, a digital I/O or analog input; UART RX0 is always assigned to this pin when selected.
8 C2CK/RST bidirectional Clock signal for the C2 development interface and device reset, an open-drain output of the internal POR or VDD monitor that an external source can drive low for at least 10 µs to reset the system.
9 P0.6/CNVSTR bidirectional Port 0.6, a digital I/O or analog input, or the ADC external convert start input strobe.
10 C2D/P0.7 bidirectional Data signal for the C2 development interface or Port 0.7, a digital I/O or analog input.
11 GND power_in Ground, which is the center exposed pad of the QFN package.

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package WSON-10-EP(3x3)
Category Embedded Processors & Controllers
Pins 11

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body 29

CAD (KiCad official)

  • Symbol: C8051F300-GMR
  • Footprint: Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm
  • 3D model: WSON-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: c8051f300-gmr-etched.step / c8051f300-gmr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); c8051f300-gmr.step / c8051f300-gmr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (178 pp, sha256 e85f1b2727e2de75, retrieved 2026-11-10, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF