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Contents

README

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SMAJ30CAHM2G

Taiwan Semiconductor · TVS · SMA

SMAJ30CAHM2G from Taiwan Semiconductor, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Bidirectional TVS terminal with electrical characteristics identical in both directions (SMAJ30A values: VWM 30 V, VBR 33.3-36.8 V at 1 mA, VC 48.4 V at 8.3 A, 400 W peak pulse power at 10/1000 µs).
2 A2 passive Second bidirectional TVS terminal, interchangeable with the other terminal because the C/CA suffix part has no cathode band and the same characteristics in both directions (VWM 30 V, 400 W peak pulse power at 10/1000 µs).

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor
Package SMA
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage VBR 33.3 36.8 V @ IT = 1 mA, pulse test PW=30 ms 2
Test current IT 1 mA 2
Working stand-off voltage VWM 30 V 2
Maximum reverse leakage current IR 1 µA @ VWM, pulse test PW=30 ms 2
Maximum peak impulse current IPPM 8.3 A 10/1000µs waveform 2
Maximum clamping voltage VC 48.4 V @ IPPM, 10/1000µs waveform 2
Peak power dissipation PPK 400 W TA=25°C, tp=1ms 1
Steady state power dissipation PD 1 W 1
Peak forward surge current IFSM 40 A 8.3 ms single half sine-wave superimposed on rated load 1
Operating junction temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test 1

CAD (KiCad official)

  • Symbol: SMAJ30CAHM2G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: smaj30cahm2g-etched.step / smaj30cahm2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smaj30cahm2g.step / smaj30cahm2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor datasheet (8 pp, sha256 6a5d121244fc257f, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF