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Contents

README

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LMR33620ADDAR

Texas Instruments · DC-DC Converters · SOIC-8-EP

LMR33620ADDAR from Texas Instruments, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND power_in Power ground terminal. Connect to system ground and AGND. Connect to input bypass capacitor with short, wide traces to minimize switching-loop parasitics.
2 VIN power_in Input supply to regulator, 3.8 V to 36 V (absolute max 38 V). Connect a high-quality bypass capacitor directly between this pin and PGND with short wide traces.
3 EN input Enable input to regulator (analog precision-enable). High = ON, low = OFF; rising switching threshold ~1.231 V with 100 mV hysteresis. Can be tied directly to VIN. Do not float. Absolute max VIN+0.3 V.
4 PG output Open-drain power-good flag output. Connect to a suitable voltage supply through a current-limiting resistor. High = power OK, low = power bad. Pulls low when EN = low. Can be left open when not used. Max PG-to-AGND rating 22 V (recommended operating max 18 V).
5 FB input Feedback input to regulator. Connect to the tap point of the external output-voltage divider. Reference voltage 1.000 V typical (0.985-1.015 V). Do not float, do not ground.
6 VCC power_out Internal 5-V LDO output (4.75-5.25 V). Used as supply to internal control circuits. Do not connect to external loads; can be used as logic supply for the power-good flag. Connect a high-quality 1-µF ceramic bypass capacitor from this pin to GND.
7 BOOT passive Bootstrap supply voltage for the internal high-side driver. Connect a high-quality 100-nF ceramic capacitor from this pin to SW. Absolute max BOOT-to-SW rating 5.5 V; UVLO 2.2 V.
8 SW power_out Regulator switch node. Connect to the power inductor. Absolute max SW-to-PGND: −0.3 to VIN+0.3 V steady state, and −3.5 to 38 V for <100-ns transients.
PAD AGND power_in Thermal pad - Analog ground for regulator and system. Ground reference for internal references and logic; all electrical parameters are measured with respect to this pin. Connect to system ground on PCB. The pad on the bottom of the HSOIC package serves as both the AGND connection and the thermal connection to the ground plane; must be soldered to a ground plane for proper electrical and thermal performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8-EP
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • LMR33620ADDAR
  • LMR33620ADDARBDDA
  • LMR33620ADDARBDDAR
  • LMR33620ADDARCDDA
  • LMR33620ADDARCDDAR
  • LMR33620ADDARNX
  • LMR33620ADDARNXR
  • LMR33620ADDARBRNX
  • LMR33620ADDARBRNXR
  • LMR33620ADDARCRNX
  • LMR33620ADDARCRNXR

CAD (KiCad official)

  • Symbol: LMR33620ADDAR
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
lmr33620addar.step 125 KB You want the bare part, or you mark your own boards.
lmr33620addar-etched.step 2.7 MB You want the part with LMR33620ADDAR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 672 faces against 152 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (54 pp, sha256 770bc060a413e296, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF