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REAR56957BGSM#HC0

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RENESAS Supervisor And Reset ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)rear56957bgsm#hc0factory-2.0.0extractor-text

Verified REAR56957BGSM#HC0

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier lcsc, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: REAR56957BGSM#HC0 · SOP-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 12-page datasheet
  • ✓distributor: lcsc C20353942, digikey 559-REAR56957BGSM#HC0TR-ND, mouser 968-REAR56957BGSMHC0
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-9sorwqw7/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): the datasheet dimensions give no height or body size to compare (datasheet p.6)
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ rear56957bgsm-hc0.kicad_sym✓ rear56957bgsm-hc0.kicad_mod✓ rear56957bgsm-hc0.step
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

REAR56957BGSM#HC0

RENESAS · Supervisor And Reset ICs · SOP-8

REAR56957BGSM#HC0 from RENESAS, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 Input input Detection voltage sense input with a 1.25V (typ) threshold; recommended range is about 0.8V to VCC-0.3V for VCC ≤ 7V, and about 0.8V to 6.7V for VCC > 7V.
3 NC unconnected No connection.
4 GND power_in Ground.
5 Delay capacitor passive Connects the external delay capacitor Cd (4700pF to 10µF) charged by a 5µA (typ) constant current, giving td ≈ 0.34 × Cd(pF) µs.
6 Output output Open-collector reset output (type B) that needs a pull-up resistor RL; it can be pulled up to 17V max, with sink current of 4mA or less recommended (6mA absolute maximum).
7 Power-supply power_in Power supply input (VCC), 2V to 17V recommended operating range, absolute maximum 18V.
8 NC unconnected No connection.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Detecting Voltage VS 1.2 1.25 1.3 V 3
Hysteresis Voltage ΔVS 9 15 23 mV VCC = 5V 3
Input Current IIN 100 500 nA VIN = 1.25V 3
Circuit Current ICC 360 540 µA Type B, VCC = 5V 3
Delay Time tpd 1.6 3.4 7 ms Cd = 0.01μF 3
Constant Current Ipd -8 -5 -3 µA VCC = 5V 3
Output Saturation Voltage Vsat 0.2 0.4 V VCC = 5V, VIN < 1.2V, ISINK = 4mA 3
Threshold Operating Voltage VOPL 0.67 0.9 V RL = 2.2kΩ, Vsat ≤ 0.4V 3
Threshold Operating Voltage VOPL 0.55 0.8 V RL = 100kΩ, Vsat ≤ 0.4V 3
Output Leakage Current IOH 30 nA Type B, Vout ≤ 17V 3
Supply Voltage Range VCC 2 17 V 3
Input Voltage Range VIN -0.3 7 V VCC > 7V 3
Detecting Voltage Temperature Coefficient VS/ΔT 0.01 %/˚C 3
Supply Voltage (recommended) VCC 2 17 V 3
Supply Voltage VCC -0.3 18 V Ta=25˚C 3
Output Sink Current ISINK 6 mA Ta=25˚C 3
Output Applied Voltage VO -0.3 18 V Type B (open collector output) 3
Total Power Dissipation Pd 440 mW Ta=25˚C 3
Thermal Derating Kθ 4.4 mW/˚C Refer to the thermal derating curve. 3
Operating Temperature Topr -40 85 ˚C 3
Storage Temperature Tstg -55 125 ˚C 3
Input Voltage Range (VCC ≤ 7V) VIN -0.3 V VCC ≤ 7V, max is VCC 3
Input Voltage Range (VCC > 7V) VIN -0.3 7 V VCC > 7V 3

CAD (KiCad official)

  • Symbol: REAR56957BGSM#HC0
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: rear56957bgsm-hc0-etched.step / rear56957bgsm-hc0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rear56957bgsm-hc0.step / rear56957bgsm-hc0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (12 pp, sha256 5190d222e22518f7, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF