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Contents

README

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HX25Q16DRG

HANSCHIP semiconductor · NOR FLASH · SOP-8

HX25Q16DRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input SPI Chip Select, active low. When high the device is deselected and the DO/IO pins are at high impedance; when low the device is selected and accepts commands. Must transition high-to-low before each new instruction.
2 DO/IO1 bidirectional Serial Data Output in Standard SPI (data shifted out on falling edge of CLK). Becomes bidirectional IO1 in Dual and Quad SPI modes for receiving instructions/addresses/data and shifting out data.
3 WP#/IO2 bidirectional Write Protect input in Standard/Dual SPI, active low; used with Status Register block-protect bits (BP0-2, TB, SEC, CMP) and SRP0 to hardware-protect memory regions. Becomes bidirectional IO2 in Quad SPI mode when QE=1.
4 GND power_in Ground reference (0V).
5 DI/IO0 bidirectional Serial Data Input in Standard SPI; receives instructions, addresses, and program data latched on the rising edge of CLK. Becomes bidirectional IO0 in Dual and Quad SPI modes.
6 CLK input SPI Serial Clock input, up to 104MHz. Provides timing for serial input (latched on rising edge) and output (shifted on falling edge). Supports SPI mode 0 (CPOL=0, CPHA=0) and mode 3 (CPOL=1, CPHA=1).
7 HOLD#/RESET#/IO3 bidirectional Multi-function pin. In Standard/Dual SPI it acts as HOLD# (active low; pauses the device while selected) when HRSW=0, or as hardware RESET# (drive low ~1us to reset) when HRSW=1. Becomes bidirectional IO3 in Quad SPI mode when QE=1.
8 VCC power_in Power supply, 2.3V to 3.6V (nominal 3V). Typical active current 9mA; typical power-down current 3uA.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HX25Q16DRG
  • HX25Q16DRGPWRG
  • HX25Q16DRGDGKRG
  • HX25Q16DRGDQRG

CAD (KiCad official)

  • Symbol: HX25Q16DRG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx25q16drg-etched.step / hx25q16drg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx25q16drg.step / hx25q16drg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (57 pp, sha256 718416e301737562, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF