component
HX25Q16DRG
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HANSCHIP semiconductor NOR FLASH, SOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHX25Q16DRG
HANSCHIP semiconductor · NOR FLASH · SOP-8
HX25Q16DRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | SPI Chip Select, active low. When high the device is deselected and the DO/IO pins are at high impedance; when low the device is selected and accepts commands. Must transition high-to-low before each new instruction. |
| 2 | DO/IO1 | bidirectional | Serial Data Output in Standard SPI (data shifted out on falling edge of CLK). Becomes bidirectional IO1 in Dual and Quad SPI modes for receiving instructions/addresses/data and shifting out data. |
| 3 | WP#/IO2 | bidirectional | Write Protect input in Standard/Dual SPI, active low; used with Status Register block-protect bits (BP0-2, TB, SEC, CMP) and SRP0 to hardware-protect memory regions. Becomes bidirectional IO2 in Quad SPI mode when QE=1. |
| 4 | GND | power_in | Ground reference (0V). |
| 5 | DI/IO0 | bidirectional | Serial Data Input in Standard SPI; receives instructions, addresses, and program data latched on the rising edge of CLK. Becomes bidirectional IO0 in Dual and Quad SPI modes. |
| 6 | CLK | input | SPI Serial Clock input, up to 104MHz. Provides timing for serial input (latched on rising edge) and output (shifted on falling edge). Supports SPI mode 0 (CPOL=0, CPHA=0) and mode 3 (CPOL=1, CPHA=1). |
| 7 | HOLD#/RESET#/IO3 | bidirectional | Multi-function pin. In Standard/Dual SPI it acts as HOLD# (active low; pauses the device while selected) when HRSW=0, or as hardware RESET# (drive low ~1us to reset) when HRSW=1. Becomes bidirectional IO3 in Quad SPI mode when QE=1. |
| 8 | VCC | power_in | Power supply, 2.3V to 3.6V (nominal 3V). Typical active current 9mA; typical power-down current 3uA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
HX25Q16DRGHX25Q16DRGPWRGHX25Q16DRGDGKRGHX25Q16DRGDQRG
CAD (KiCad official)
- Symbol:
HX25Q16DRG - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hx25q16drg-etched.step/hx25q16drg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx25q16drg.step/hx25q16drg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HANSCHIP semiconductor datasheet (57 pp, sha256
718416e301737562, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).