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PIC16F1516-E

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Microchip Tech Microcontroller Units (MCUs/MPUs/SOCs), SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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PIC16F1516-E

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · SOIC-28-300mil

PIC16F1516-E from Microchip Tech, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RE3/MCLR/VPP input General purpose input with weak pull-up (RE3), Master Clear reset input with internal pull-up (MCLR), or high-voltage programming voltage input (VPP).
2 RA0/AN0/SS bidirectional General purpose I/O (TTL input, CMOS output) with ADC channel 0 input and alternate-location SPI Slave Select input.
3 RA1/AN1 bidirectional General purpose I/O (TTL input, CMOS output) with ADC channel 1 input.
4 RA2/AN2 bidirectional General purpose I/O (TTL input, CMOS output) with ADC channel 2 input.
5 RA3/AN3/VREF+ bidirectional General purpose I/O (TTL input, CMOS output) with ADC channel 3 input and ADC positive voltage reference input.
6 RA4/T0CKI bidirectional General purpose I/O (TTL input, CMOS output) with Timer0 clock input.
7 RA5/AN4/SS/VCAP bidirectional General purpose I/O with ADC channel 4 input, default-location SPI Slave Select input, and voltage regulator filter capacitor pin (PIC16F1516 only).
8 VSS power_in Ground reference.
9 RA7/OSC1/CLKIN bidirectional General purpose I/O, crystal/resonator connection (LP, XT, HS modes), or external clock input (EC mode).
10 RA6/OSC2/CLKOUT bidirectional General purpose I/O, crystal/resonator connection (LP, XT, HS modes), or FOSC/4 clock output.
11 RC0/SOSCO/T1CKI bidirectional General purpose I/O, secondary oscillator connection, or Timer1 clock input.
12 RC1/SOSCI/CCP2 bidirectional General purpose I/O, secondary oscillator connection, or Capture/Compare/PWM 2 (default location).
13 RC2/AN14/CCP1 bidirectional General purpose I/O with ADC channel 14 input and Capture/Compare/PWM 1.
14 RC3/AN15/SCK/SCL bidirectional General purpose I/O with ADC channel 15 input, SPI clock, or I2C clock (open-drain).
15 RC4/AN16/SDI/SDA bidirectional General purpose I/O with ADC channel 16 input, SPI data input, or I2C data input/output (open-drain).
16 RC5/AN17/SDO bidirectional General purpose I/O with ADC channel 17 input or SPI data output.
17 RC6/AN18/TX/CK bidirectional General purpose I/O with ADC channel 18 input, USART asynchronous transmit, or USART synchronous clock.
18 RC7/AN19/RX/DT bidirectional General purpose I/O with ADC channel 19 input, USART asynchronous receive, or USART synchronous data.
19 VSS power_in Ground reference.
20 VDD power_in Positive supply; 2.3V-5.5V for PIC16F1516.
21 RB0/AN12/INT bidirectional General purpose I/O with IOC and weak pull-up, ADC channel 12 input, and external interrupt.
22 RB1/AN10 bidirectional General purpose I/O with IOC and weak pull-up, and ADC channel 10 input.
23 RB2/AN8 bidirectional General purpose I/O with IOC and weak pull-up, and ADC channel 8 input.
24 RB3/AN9/CCP2 bidirectional General purpose I/O with IOC and weak pull-up, ADC channel 9 input, and alternate-location Capture/Compare/PWM 2.
25 RB4/AN11 bidirectional General purpose I/O with IOC and weak pull-up, and ADC channel 11 input.
26 RB5/AN13/T1G bidirectional General purpose I/O with IOC and weak pull-up, ADC channel 13 input, and Timer1 gate input.
27 RB6/ICSPCLK bidirectional General purpose I/O with IOC and weak pull-up, or in-circuit serial programming clock.
28 RB7/ICSPDAT bidirectional General purpose I/O with IOC and weak pull-up, or ICSP data I/O.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-28-300mil
Category Single Chip Microcomputer/Microcontroller
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage on VDD with respect to VSS VDD -0.3 6.5 V PIC16F1516/7/8/9 265
Voltage on MCLR with respect to VSS -0.3 9 V 265
Voltage on all other pins with respect to VSS -0.3 V -0.3V to (VDD + 0.3V) 265
Ambient temperature under bias -40 125 °C 265
Storage temperature -65 150 °C 265
Maximum current on VSS pin, 28-pin 350 mA -40°C ≤ TA ≤ +85°C 265
Maximum current on VSS pin, 28-pin 120 mA +85°C ≤ TA ≤ +125°C 265
Maximum current on VDD pin, 28-pin 250 mA -40°C ≤ TA ≤ +85°C 265
Maximum current on VDD pin, 28-pin 85 mA +85°C ≤ TA ≤ +125°C 265
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 265
Maximum output current sunk by any I/O pin 50 mA 265
Maximum output current sourced by any I/O pin 50 mA 265
Operating supply voltage VDD 2.3 5.5 V FOSC ≤ 16 MHz 269
Operating supply voltage VDD 2.5 5.5 V 16 MHz < FOSC ≤ 20 MHz 269
Operating ambient temperature (Extended) TA -40 125 °C Extended temperature 266
RAM Data Retention Voltage VDR 1.7 V Device in Sleep mode 269
Power-on Reset Release Voltage VPOR 1.6 V 269
Power-on Reset Rearm Voltage VPORR 1.42 V 269
Fixed Voltage Reference Voltage for ADC VADFVR -8 6 % 1.024V, VDD ≥ 2.5V; 2.048V, VDD ≥ 2.5V; 4.096V, VDD ≥ 4.75V 269
VDD Rise Rate SVDD 0.05 V/ms to ensure internal Power-on Reset signal 269
Supply Current, LP oscillator 32 kHz IDD 11 28 µA FOSC = 32 kHz LP, VDD = 2.3V, -40°C ≤ TA ≤ +85°C 271
Supply Current, LP oscillator 32 kHz IDD 14 45 µA FOSC = 32 kHz LP, VDD = 5.0V 271
Supply Current, XT 4 MHz IDD 370 650 µA FOSC = 4 MHz XT, VDD = 5.0V 271
Supply Current, EC high-power 20 MHz IDD 1.7 2 mA FOSC = 20 MHz EC high-power, VDD = 5.0V 272
Supply Current, HFINTOSC 16 MHz IDD 1.2 1.7 mA FOSC = 16 MHz HFINTOSC, VDD = 5.0V 272
Supply Current, HS 20 MHz IDD 1.7 2.1 mA FOSC = 20 MHz HS, VDD = 5.0V 273
Base power-down current, +85°C IPD 0.47 6 µA VDD = 5.0V, WDT, BOR, FVR, SOSC disabled, low-power regulator active; max at +85°C 274
Base power-down current, +125°C IPD 0.47 15 µA VDD = 5.0V, WDT, BOR, FVR, SOSC disabled, low-power regulator active; max at +125°C 274
LPWDT current, +125°C IPD 0.85 22 µA VDD = 5.0V, LPWDT Current 274
Input Low Voltage, TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 276
Input Low Voltage, SMBus levels VIL 0.8 V 2.7V ≤ VDD ≤ 5.5V 276
Input High Voltage, TTL buffer VIH 2 V 4.5V ≤ VDD ≤ 5.5V 276
Input High Voltage, SMBus levels VIH 2.1 V 2.7V ≤ VDD ≤ 5.5V 276
Input Leakage Current, I/O ports (85°C) IIL -125 5 125 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance at 85°C 276
Input Leakage Current, I/O ports (125°C) IIL -1000 5 1000 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance at 125°C 276
Input Leakage Current, MCLR IIL -200 50 200 nA VSS ≤ VPIN ≤ VDD at 85°C 276
Weak Pull-up Current IPUR 25 100 200 µA VDD = 3.3V, VPIN = VSS 276
Weak Pull-up Current IPUR 25 140 300 µA VDD = 5.0V, VPIN = VSS 276
Output Low Voltage, I/O ports VOL 0.6 V IOL = 8 mA, VDD = 5V; IOL = 6 mA, VDD = 3.3V; IOL = 1.8 mA, VDD = 1.8V 276
Output High Voltage, I/O ports VOH -0.7 V VDD - 0.7 min; IOH = 3.5 mA, VDD = 5V; IOH = 3 mA, VDD = 3.3V; IOH = 1 mA, VDD = 1.8V 277
OSC2 pin capacitive loading COSC2 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 277
All I/O pins capacitive loading CIO 50 pF 277
Voltage on MCLR/VPP pin VIHH 8 9 V Note 2 278
Supply Current during Programming IDDP 10 mA 278
VDD for Bulk Erase VBE 2.7 V max VDDMAX 278
Self-timed Write Cycle Time TIW 2 2.5 ms 278
Thermal Resistance Junction to Ambient θJA 69.7 °C/W 28-pin SOIC package 279
Thermal Resistance Junction to Case θJC 18.9 °C/W 28-pin SOIC package 279
Maximum Junction Temperature TJMAX 150 °C 279
Brown-out Reset Voltage VBOR 2.55 2.7 2.85 V BORV = 0 285
Brown-out Reset Voltage VBOR 2.35 2.45 2.58 V BORV = 1 (PIC16F1516/7/8/9) 285
Low-Power Brown-out Reset Voltage VLPBOR 1.8 2.1 2.5 V LPBOR = 0 285
Power-up Timer Period TPWRT 40 65 140 ms PWRTE = 0 285
Low-Power Watchdog Timer Time-out Period TWDTLP 10 16 27 ms VDD = 3.3V-5V, 1:512 Prescaler used 285
ADC Integral Error EIL 1 1.7 LSb VREF = 3.0V 288
ADC Offset Error EOFF 1 2.5 LSb VREF = 3.0V 288
ADC Reference Voltage VREF 1.8 V VREF = (VREF+ minus VREF-); max VDD 288

CAD (KiCad official)

  • Symbol: PIC16F1516-E
  • Footprint: Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm
  • 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
  • 3D model files: pic16f1516-e-etched.step / pic16f1516-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f1516-e.step / pic16f1516-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (359 pp, sha256 36ecb0635584b704, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF