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Contents

README

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PMV28UNEAR

Nexperia · MOSFETs · SOT-23

PMV28UNEAR from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the N-channel MOSFET; gate-source voltage is rated at -8 V to 8 V (Table 5, page 3).
2 S passive Source of the MOSFET; source current IS is rated at 1 A maximum at Tamb = 25 °C (Table 5, page 3).
3 D passive Drain of the MOSFET; drain-source voltage VDS is rated at 20 V maximum and continuous drain current ID at 4.7 A maximum with VGS = 4.5 V and Tamb = 25 °C (Table 5, page 3).

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
drain-source voltage VDS 20 V 3
gate-source voltage VGS -8 8 V Tj = 25 °C 3
drain current ID 4.7 A VGS = 4.5 V; Tamb = 25 °C 3
drain current ID 2.9 A VGS = 4.5 V; Tamb = 100 °C 3
peak drain current IDM 19 A Tamb = 25 °C; single pulse; tp ≤ 10 µs 3
non-repetitive drain-source avalanche energy EDS(AL)S 3.3 mJ Tj(init) = 25 °C; ID = 0.33 A; DUT in avalanche (unclamped) 3
total power dissipation Ptot 510 mW Tamb = 25 °C [2] 3
total power dissipation Ptot 1.05 W [1] 3
total power dissipation Ptot 3.9 W Tsp = 25 °C 3
junction temperature Tj -55 150 °C 3
ambient temperature Tamb -55 150 °C 3
storage temperature Tstg -65 150 °C 3
source current IS 1 A Tamb = 25 °C [1] 3
electrostatic discharge voltage VESD 2000 V HBM [3] 3
thermal resistance from junction to ambient in free air Rth(j-a) 211 245 K/W [1] FR4 PCB, single-sided copper, tin-plated and standard footprint 5
thermal resistance from junction to ambient in free air Rth(j-a) 102 120 K/W [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2 5
thermal resistance from junction to solder point Rth(j-sp) 21 32 K/W 5
drain-source breakdown voltage V(BR)DSS 20 V ID = 250 µA; VGS = 0 V; Tj = 25 °C 6
gate-source threshold voltage VGSth 0.45 0.7 1 V ID = 250 µA; VDS = VGS; Tj = 25 °C 6
drain leakage current IDSS 1 µA VDS = 20 V; VGS = 0 V; Tj = 25 °C 6
drain leakage current IDSS 10 µA VGS = 8 V; VDS = 0 V; Tj = 25 °C 6
drain leakage current IDSS -10 µA VGS = -8 V; VDS = 0 V; Tj = 25 °C 6
drain leakage current IDSS 5 µA VGS = 4.5 V; VDS = 0 V; Tj = 25 °C 6
drain leakage current IDSS -5 µA VGS = -4.5 V; VDS = 0 V; Tj = 25 °C 6
drain leakage current IDSS 100 nA VGS = 2.5 V; VDS = 0 V; Tj = 25 °C 6
gate leakage current IGSS -100 nA VGS = -2.5 V; VDS = 0 V; Tj = 25 °C 6
drain-source on-state resistance RDSon 24 32 mΩ VGS = 4.5 V; ID = 4.7 A; Tj = 25 °C 6
drain-source on-state resistance RDSon 36 48 mΩ VGS = 4.5 V; ID = 4.7 A; Tj = 150 °C 6
drain-source on-state resistance RDSon 29 45 mΩ VGS = 2.5 V; ID = 3.9 A; Tj = 25 °C 6
drain-source on-state resistance RDSon 40 70 mΩ VGS = 1.8 V; ID = 3.1 A; Tj = 25 °C 6
total gate charge QG(tot) 6.2 10 nC 6
source-drain voltage VSD 0.6 1.2 V IS = 1 A; VGS = 0 V; Tj = 25 °C 6

CAD (KiCad official)

  • Symbol: PMV28UNEAR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: pmv28unear-etched.step / pmv28unear-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmv28unear.step / pmv28unear.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (16 pp, sha256 6625632db1ca41e3, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF