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Contents

README

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74LVCE1G07W5-7

Diodes Incorporated · Gates · SOT-25-5

74LVCE1G07W5-7 from Diodes Incorporated, in a SOT-25-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 A input Data input, tolerant to 5.5 V (VI 0 to 5.5 V recommended), with unused inputs held at Vcc or ground.
3 GND power_in Ground.
4 Y output Open-drain data output that is low when A is low and high-impedance when A is high, with a maximum sink current of 32 mA at Vcc = 4.5 V and a voltage rating of up to 5.5 V in the high-impedance state.
5 Vcc power_in Supply voltage, recommended operating range 1.4 V to 5.5 V and absolute maximum -0.5 V to 6.5 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-25-5
Category Logic ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Voltage VCC 1.4 5.5 V Operating 4
High-level Input Voltage VIH 0.65 X VCC VCC = 1.4 V to 1.95 V 4
High-level Input Voltage VIH 1.7 V VCC = 2.3 V to 2.7 V 4
High-level Input Voltage VIH 2 V VCC = 3 V to 3.6 V 4
High-level Input Voltage VIH 0.7 X VCC VCC = 4.5 V to 5.5 V 4
Low-level Input Voltage VIL 0.35 X VCC VCC = 1.4 V to 1.95 V 4
Low-level Input Voltage VIL 0.7 V VCC = 2.3 V to 2.7 V 4
Low-level Input Voltage VIL 0.8 V VCC = 3 V to 3.6 V 4
Low-level Input Voltage VIL 0.3 X VCC VCC = 4.5 V to 5.5 V 4
Input Voltage VI 0 5.5 V 4
Output Voltage VO 0 V Maximum printed as VCC 4
Low-level output current IOL 3 mA VCC = 1.4 V 4
Low-level output current IOL 4 mA VCC = 1.65 V 4
Low-level output current IOL 8 mA VCC = 2.3 V 4
Low-level output current IOL 32 mA VCC = 4.5 V 4
Input transition rise or fall rate Δt/ΔV 20 ns/V VCC = 1.4 V to 3.0 V 4
Input transition rise or fall rate Δt/ΔV 10 ns/V VCC = 3.3 V ± 0.3 V 4
Input transition rise or fall rate Δt/ΔV 5 ns/V VCC = 5 V ± 0.5 V 4
Operating free-air temperature TA -40 85 ºC 4
ESD HBM Human Body Model ESD Protection ESD HBM 2 KV Human Body Model 3
ESD MM Machine Model ESD Protection ESD MM 200 V Machine Model 3
Supply Voltage Range VCC -0.5 6.5 V 3
Input Voltage Range VI -0.5 6.5 V 3
Voltage applied to output in high impedance or IOFF state Vo -0.5 6.5 V High impedance or IOFF state 3
Voltage applied to output in high or low state Vo -0.3 V High or low state; upper limit printed as VCC +0.5 V 3
Input Clamp Current IIK -50 mA VI<0 3
Output Clamp Current IOK -50 mA 3
Continuous output current IO -50 50 mA 3
Continuous current through VCC or GND (printed Vdd) -100 100 mA 3
Operating Junction Temperature TJ -40 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Low Level Output Voltage VOL 0.1 V IOL = 100 μA; VCC 1.4 V to 5.5 V 5
Low Level Output Voltage VOL 0.4 V IOL = 3 mA; VCC 1.4 V 5
Low Level Output Voltage VOL 0.45 V IOL = 4 mA; VCC 1.65 V 5
Low Level Output Voltage VOL 0.3 V IOL = 8 mA; VCC 2.3 V 5
Low Level Output Voltage VOL 0.55 V IOL = 24 mA; VCC 3 V 5
Input Current II -5 5 μA VI = 5.5 V or GND; VCC 0 to 5.5 V 5
Z State Leakage Current IOZ -10 10 μA VO = 5.5 V; VCC 3.6 V 5
Power Down Leakage Current IOFF -10 10 μA VI or VO = 5.5 V; VCC 0 V 5
Supply Current ICC 10 μA VI = 5.5 V or GND; IO=0; VCC 1.4 V to 5.5 V 5
Additional Supply Current ΔICC 500 μA Input at VCC -0.6 V; VCC 3 V to 5.5 V 5
Propagation delay (tpd), VCC = 1.5 V ± 0.1 V tpd 1.5 9.9 ns A to Y; CL = 15 pF; VCC 1.5 V ± 0.1 V 6
Propagation delay (tpd), VCC = 1.8 V ± 0.15 V tpd 1 5.8 ns A to Y; CL = 15 pF; VCC 1.8 V ± 0.15 V 6
Propagation delay (tpd), VCC = 2.5 V ± 0.2 V tpd 0.8 4.4 ns A to Y; CL = 15 pF; VCC 2.5 V ± 0.2 V 6
Propagation delay (tpd), VCC = 3.3 V ± 0.3 V tpd 0.8 3.4 ns A to Y; CL = 15 pF; VCC 3.3 V ± 0.3 V 6
Propagation delay (tpd), VCC = 5 V ± 0.5 V tpd 0.8 3.1 ns A to Y; CL = 15 pF; VCC 5 V ± 0.5 V 6
Thermal Resistance Junction-to-Case (printed as junction-to-case; symbol θJA) SOT25 θJA 204 ºC/W SOT25; device mounted on FR-4, 2oz copper, minimum recommended pad layout 5
Thermal Resistance Junction-to-Case SOT25 θJC 52 ºC/W SOT25; device mounted on FR-4, 2oz copper, minimum recommended pad layout 5

CAD (KiCad official)

  • Symbol: 74LVCE1G07W5-7
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-25-5 (KiCad packages3D, STEP)
  • 3D model files: 74lvce1g07w5-7-etched.step / 74lvce1g07w5-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74lvce1g07w5-7.step / 74lvce1g07w5-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (13 pp, sha256 481d84266edac631, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF