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Contents

README

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RLM12FTCMR014

TA I Tech · Current Sense Resistors / Shunt Resistors · 1206

RLM12FTCMR014 from TA I Tech, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer TA I Tech
Package 1206
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Tolerance -1 1 % Tolerance code F (±1%) in part number RLM12FTCMR014 1
Temperature coefficient of resistance TCR -50 50 ppm/℃ Test per IEC60115-1 4.8, +25 to 125℃ 2
Operation temperature range -55 170 ℃ 2
Insulation resistance 100 MΩ 2
High temperature exposure (storage) change in resistance ΔR -1 1 % MIL-STD-202 108, T=125℃, 1000 h, measured 24 h after test 2
Low temperature operation change in resistance ΔR -0.5 0.5 % IEC60115-1 4.23.4, -55℃ for 45 min 2
Temperature cycling change in resistance ΔR -0.5 0.5 % JESD22 JA-104, 1000 cycles (-55℃ to 125℃), measured 24 h after test 2
Short time overload change in resistance ΔR -0.5 0.5 % IEC60115-1 4.13, 5 × rated power for 5 s 2
Biased humidity change in resistance ΔR -0.5 0.5 % MIL-STD-202 103, 10% rated voltage at 85℃, RH 85%, 1000 h, measured 24 h after test 2
Operation life change in resistance ΔR -1 1 % MIL-STD-202 108, 1000 h at +70℃, 1.5 h ON, 0.5 h OFF 2
Resistance to soldering heat change in resistance ΔR -0.5 0.5 % IEC60115-1 4.18, 260±5℃ solder, 10±1 s dwell 2
Mechanical shock change in resistance ΔR -0.5 0.5 % MIL-STD-202 213, 100 g, 6 ms half sine pulse 2
Vibration change in resistance ΔR -0.5 0.5 % MIL-STD-202 204, 5 g, 20 min, 12 cycles, 10-2000 Hz 2
Board flex change in resistance ΔR -0.5 0.5 % AEC-Q200-005, min 2 mm deflection, 60 s 2
Storage temperature 5 35 ℃ Storage conditions prior to use 5
Storage humidity 40 75 % Storage conditions prior to use 5
Reflow peak temperature 250 ℃ IR reflow, peak, 5 s, solder Sn96.5/Ag3/Cu0.5 6
Rated power P 1 W Power code C = 1 W for 1206 size; footnote: 1 W with total solder pad and trace size of 300 mm² 2

CAD (KiCad official)

  • Symbol: RLM12FTCMR014
  • Footprint: Resistor_SMD:R_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: rlm12ftcmr014-etched.step / rlm12ftcmr014-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rlm12ftcmr014.step / rlm12ftcmr014.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TA I Tech datasheet (6 pp, sha256 6f3e3568fbc984ef, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF