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Contents

README

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SP010N06BGTQ

Siliup · MOSFETs · TO-220-3L

SP010N06BGTQ from Siliup, in a TO-220-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate is rated for a Gate-Source Voltage VGS of ±20 V per the absolute maximum ratings.
2 D passive Drain is rated for a Drain-Source Voltage VDS of 100 V and a Continuous Drain Current ID of 110 A at Tc=25℃.
3 S passive Source is the reference terminal, with a Maximum Body-Diode Continuous Current IS of 110 A.

Key specifications

Parameter Value
Manufacturer Siliup
Package TO-220-3L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 100 V 2
Gate-Source Voltage VGS -20 20 V 2
Continuous Drain Current ID 110 A Tc=25℃ 2
Continuous Drain Current ID 73 A Tc=100℃ 2
Pulsed Drain Current IDM 440 A 2
Single Pulse Avalanche Energy EAS 256 mJ VDD=50V, VGS=10V, L=0.5mH, RG=25Ω (Note 1) 2
Power Dissipation PD 125 W Tc=25℃ 2
Thermal Resistance Junction-to-Case RθJC 1 ℃/W 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2
Drain-Source Breakdown Voltage BVDSS 100 V ID = 250μA, VGS = 0V 2
Drain Cut-Off Current IDSS 1 uA VDS = 80V, VGS = 0V 2
Gate Leakage Current IGSS -100 100 nA VGS = ±20V, VDS = 0V 2
Gate Threshold Voltage VGS(th) 1 1.7 2.5 V VDS = VGS, ID = 250μA 2
Drain-Source ON Resistance RDS(ON) 6.5 8.2 mΩ VGS = 10V, ID = 40A 2
Drain-Source ON Resistance RDS(ON) 8.1 10 mΩ VGS = 4.5V, ID = 30A 2
Source-Drain Diode Forward Voltage VSD 1.2 V VGS=0V, IS=1A, TJ=25℃ 2
Maximum Body-Diode Continuous Current IS 110 A 2

CAD (KiCad official)

  • Symbol: SP010N06BGTQ
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220-3L (KiCad packages3D, STEP)
  • 3D model files: sp010n06bgtq-etched.step / sp010n06bgtq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp010n06bgtq.step / sp010n06bgtq.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Siliup datasheet (5 pp, sha256 8647b175222fbdd2, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF