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Contents

README

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IXDD604PI

Littelfuse IXYS · Gate Drivers · DIP-8

IXDD604PI from Littelfuse IXYS, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ENA input Channel A enable input; drive low to disable Channel A and force its output to a high-impedance state (internal 200kΩ pull-up to VCC, so open = enabled).
2 INA input Channel A logic input (VIH 3.0V min, VIL 0.8V max at 25°C for 4.5V<VCC<18V; withstands down to -5V).
3 GND power_in Ground, the common ground reference for the device.
4 INB input Channel B logic input (VIH 3.0V min, VIL 0.8V max at 25°C for 4.5V<VCC<18V; withstands down to -5V).
5 OUTB tri_state Channel B output that sources or sinks up to 4A to turn a discrete MOSFET or IGBT on or off, and goes high-impedance when ENB is low.
6 VCC power_in Supply voltage powering the device, recommended 4.5V to 35V (absolute maximum 40V).
7 OUTA tri_state Channel A output that sources or sinks up to 4A to turn a discrete MOSFET or IGBT on or off, and goes high-impedance when ENA is low.
8 ENB input Channel B enable input; drive low to disable Channel B and force its output to a high-impedance state (internal 200kΩ pull-up to VCC, so open = enabled).

Key specifications

Parameter Value
Manufacturer Littelfuse IXYS
Package DIP-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 40 V 3
Input Voltage VINx, VENx -5 V 3
Output Current IOUT -4 4 A 3
Output Pulsed Current Iout_pulsed -5 5 A 0.5s 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage VCC 4.5 35 V 3
Operating Temperature Range TA -40 125 °C 3
Input Voltage, High VIH 3 V TA=25°C; 4.5V < VCC < 18V 4
Input Voltage, Low VIL 0.8 V TA=25°C; 4.5V < VCC < 18V 4
Input Current IIN -10 10 µA TA=25°C; 0V < VIN < VCC 4
Output Voltage, Low VOL 0.025 V TA=25°C; 4.5V < VCC < 35V 4
Output Resistance, High State ROH 1.3 2.5 Ω TA=25°C; VCC=18V, IOUT=-10mA 4
Output Resistance, Low State ROL 1.1 2 Ω TA=25°C; VCC=18V, IOUT=10mA 4
Output Current, Continuous IDC -1 1 A TA=25°C; Limited by package power dissipation 4
Rise Time tr 9 16 ns TA=25°C; VCC=18V, CLOAD=1000pF 4
Fall Time tf 8 14 ns TA=25°C; VCC=18V, CLOAD=1000pF 4
On-Time Propagation Delay tondly 29 50 ns TA=25°C; VCC=18V, CLOAD=1000pF 4
Off-Time Propagation Delay toffdly 35 50 ns TA=25°C; VCC=18V, CLOAD=1000pF 4
Enable to Output-High Delay Time tENOH 35 55 ns TA=25°C; IXDD604 only, VCC=18V 4
Disable to High Impedance State Delay Time tDOLD 40 55 ns TA=25°C; IXDD604 only, VCC=18V 4
Power Supply Current ICC 1 3 mA TA=25°C; VCC=18V, VIN=3.5V 4
Power Supply Current ICC 10 µA TA=25°C; VCC=18V, VIN=0V 4
Input Voltage, High VIH 3.3 V -40°C < TA < +125°C; 4.5V < VCC < 18V 4
Input Voltage, Low VIL 0.65 V -40°C < TA < +125°C; 4.5V < VCC < 18V 4
Output Resistance, High State ROH 3 Ω -40°C < TA < +125°C; VCC=18V, IOUT=-10mA 4
Output Resistance, Low State ROL 2.5 Ω -40°C < TA < +125°C; VCC=18V, IOUT=10mA 4
Rise Time tr 16 ns -40°C < TA < +125°C; VCC=18V, CLOAD=1000pF 4
Fall Time tf 14 ns -40°C < TA < +125°C; VCC=18V, CLOAD=1000pF 4
On-Time Propagation Delay tondly 65 ns -40°C < TA < +125°C; VCC=18V, CLOAD=1000pF 4
Off-Time Propagation Delay toffdly 65 ns -40°C < TA < +125°C; VCC=18V, CLOAD=1000pF 4
Enable to Output-High Delay Time tENOH 65 ns -40°C < TA < +125°C; IXDD604 only, VCC=18V 4
Disable to High Impedance State Delay Time tDOLD 65 ns -40°C < TA < +125°C; IXDD604 only, VCC=18V 4
Power Supply Current ICC 3.5 mA -40°C < TA < +125°C; VCC=18V, VIN=3.5V 4
Power Supply Current ICC 150 µA -40°C < TA < +125°C; VCC=18V, VIN=0V 4
Thermal Resistance, Junction-to-Ambient JA 125 °C/W PI (8-Pin DIP) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time 10

CAD (KiCad official)

  • Symbol: IXDD604PI
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: ixdd604pi-etched.step / ixdd604pi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdd604pi.step / ixdd604pi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse IXYS datasheet (14 pp, sha256 f253fa2390726f1d, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF