component
SMLMN2BCTT86C
Public Made by Adomby adom
ROHM Semicon LED Indication - Discrete, 0805. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMLMN2BCTT86C
ROHM Semicon · LED Indication - Discrete · 0805
SMLMN2BCTT86C from ROHM Semicon, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode electrode of the blue InGaN LED, on the sprocket-hole side of the T86 tape; max forward current 20 mA (100 mA pulsed at 1/10 duty, 1 kHz), max reverse voltage 12 V. |
| 2 | A | passive | Anode electrode of the blue InGaN LED; typical VF 2.9 V at IF=5 mA, power dissipation 68 mW max, drive with constant current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | 0805 |
| Category | Optoelectronics |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Current | IR | 10 | µA | VR=12 V | 1 | ||
| Dominant Wavelength (Blue) | λD | 464 | 470 | 476 | nm | IF=5 mA, Ta=25ºC | 1 |
| Luminous Intensity (Blue) | IV | 14 | 36 | mcd | IF=5 mA, Ta=25ºC | 1 | |
| Forward Current | IF | 20 | mA | Ta=25ºC | 1 | ||
| Peak Forward Current | IFP | 100 | mA | 1/10 duty, 1 kHz (*1) | 1 | ||
| Reverse Voltage | VR | 12 | V | Ta=25ºC | 1 | ||
| Power Dissipation | PD | 68 | mW | Ta=25ºC | 1 | ||
| Operating Temperature | Topr | -40 | 100 | ºC | Ta=25ºC | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs | adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of expansion and moisture absorption at humidity will cause heat stress during soldering process and | 8 |
CAD (KiCad official)
- Symbol:
SMLMN2BCTT86C - Footprint:
LED_SMD:LED_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
smlmn2bctt86c-etched.step/smlmn2bctt86c-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smlmn2bctt86c.step/smlmn2bctt86c.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (10 pp, sha256
6e82574a81e88bdb, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).