component
TPS56339DDCT
Public Made by Adomby adom
Texas Instruments DC-DC Converters, TSOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS56339DDCT
Texas Instruments · DC-DC Converters · TSOT-23-6
TPS56339DDCT from Texas Instruments, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin, the source terminal of the low-side MOSFET and ground for the controller circuit, and sensitive FB must be connected to this GND at a single point. |
| 2 | SW | output | Switch node connection between the high-side MOSFET and the low-side MOSFET. |
| 3 | VIN | power_in | Input voltage supply pin and the drain terminal of the high-side MOSFET. |
| 4 | FB | input | Converter feedback input, connected to the output voltage through a feedback resistor divider. |
| 5 | EN | input | Enable pin that floats to enable, and the input undervoltage lockout is adjusted with two resistors. |
| 6 | BOOT | output | A 30-Ω boot resistor and a 0.1-μF bootstrap capacitor are required between BOOT and SW, and this capacitor carries the gate drive voltage for the high-side MOSFET. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TSOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage VIN | VIN | -0.3 | 26 | V | 4 | ||
| Input voltage EN | EN | -0.3 | 6 | V | 4 | ||
| Input voltage BOOT | BOOT | -0.3 | V | max printed as SW+6 | 4 | ||
| Input voltage FB | FB | -0.3 | 6 | V | 4 | ||
| Output voltage BOOT-SW | BOOT-SW | -0.3 | 6 | V | 4 | ||
| Output voltage SW | SW | -0.3 | 26 | V | 4 | ||
| SW transient voltage | SW | -3 | 26 | V | <10 ns transient | 4 | |
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Input voltage VIN | VIN | 4.5 | 24 | V | 4 | ||
| Input voltage EN | EN | -0.1 | 5.5 | V | 4 | ||
| Input voltage FB | FB | -0.1 | 5.5 | V | 4 | ||
| Output voltage BOOT-SW | BOOT-SW | -0.1 | 5.5 | V | 4 | ||
| Output voltage SW | SW | -0.1 | 24 | V | 4 | ||
| Output current | IOUT | 0 | 3 | A | 4 | ||
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Input voltage operation | VIN | 4.5 | 24 | V | 5 | ||
| VIN UVLO rising threshold | VIN_UVLO | 3.9 | 4.2 | 4.4 | V | VIN rising threshold | 5 |
| VIN UVLO falling threshold | VIN_UVLO | 3.5 | 3.7 | 3.9 | V | VIN falling threshold | 5 |
| EN rising threshold | VEN_RISE | 1.18 | 1.28 | V | EN rising threshold | 5 | |
| EN falling threshold | VEN_FALL | 1.08 | 1.12 | V | EN falling threshold | 5 | |
| Reference voltage at TJ = 25 °C | VREF | 0.79 | 0.802 | 0.814 | V | TJ = 25 °C | 5 |
| Reference voltage over temperature | VREF | 0.782 | 0.802 | 0.822 | V | TJ = -40 °C to 125 °C | 5 |
| High-side MOSFET current limit | IHS_LIMIT | 3.9 | 4.7 | 5.4 | A | 5 | |
| Low-side MOSFET current limit | ILS_LIMIT | 2.7 | 3.6 | 4.7 | A | VIN = 12 V | 5 |
| Switching frequency | fSW | 420 | 500 | 600 | KHz | 5 | |
| Junction-to-ambient thermal resistance | RθJA | 119.1 | °C/W | simulated on JEDEC board | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 58.1 | °C/W | 4 | |||
| Junction-to-board thermal resistance | RθJB | 36.7 | °C/W | 4 | |||
| Junction-to-top characterization parameter | ΨJT | 9.4 | °C/W | 5 | |||
| Junction-to-board characterization parameter | ΨJB | 36.2 | °C/W | 5 |
CAD (KiCad official)
- Symbol:
TPS56339DDCT - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
tps56339ddct-etched.step/tps56339ddct-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps56339ddct.step/tps56339ddct.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (32 pp, sha256
f74e7982b0b81390, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).