component
BQ296217DSGR
Public Made by Adomby adom
Texas Instruments Battery Management, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBQ296217DSGR
Texas Instruments · Battery Management · WSON-8-EP(2x2)
BQ296217DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Power supply input for the device; rated 3V to 20V depending on REG output enable state. |
| 2 | V4 | input | Cell voltage detection input for fourth cell from battery pack bottom; accepts 0 to 5V input signal. |
| 3 | V3 | input | Cell voltage detection input for third cell from battery pack bottom; accepts 0 to 5V input signal. |
| 4 | V2 | input | Cell voltage detection input for second cell from battery pack bottom; accepts 0 to 5V input signal. |
| 5 | V1 | input | Cell voltage detection input for first cell from battery pack bottom; accepts 0 to 5V input signal. |
| 6 | VSS | power_in | Ground connection to IC and negative terminal of lowest cell in battery pack; serves as reference for all voltage measurements. |
| 7 | OUT | output | Overvoltage fault output driver; CMOS high active 6-8V or open-drain low active 250-400mV with external pull-up resistor. |
| 8 | REG | power_out | Regulated power supply output providing 3.3V at 0 to 2mA maximum load; requires 0.47µF external ceramic capacitor for stability. |
| 9 | PWPD | power_in | Exposed thermal pad; Texas Instruments recommends connection to VSS on PCB for thermal dissipation and mechanical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
BQ296217DSGR - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
bq296217dsgr-etched.step/bq296217dsgr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq296217dsgr.step/bq296217dsgr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (32 pp, sha256
e6a927461563434f, retrieved 2026-09-27, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).