Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

IXDD630MYI

IXYS · Pre-ordered Chips · TO-263-5

IXDD630MYI from IXYS, in a TO-263-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin that powers the device; absolute maximum VCC is 40 V (minimum -0.3 V), recommended operation is from UVLO to 35 V, and the IXD_630M (9 V UVLO) version used by IXDD630MYI turns on at a rising VCC of 9 V typical.
2 IN input Logic input; VIH is 3.5 V minimum and VIL is 0.8 V maximum for UVLO < VCC < 18 V, input current is limited to ±10 µA, and the input withstands a negative swing down to -5 V.
3 GND power_in Common ground reference for the device.
4 OUT output Output that sources or sinks current to turn a discrete MOSFET or IGBT on or off, rated for 30 A peak, with continuous output current limited to ±8 A by package power dissipation.
5 EN input Output enable on the IXDD630 only; driving it low disables the output and forces it to a high-impedance state, with EN input high at 2/3 VCC minimum, low at 1/3 VCC maximum, and an internal pull-up of about 400 kΩ.
6 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer IXYS
Package TO-263-5
Category Interface ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (absolute maximum) VCC -0.3 40 V 3
Input Voltage Range (absolute maximum) VIN, VEN -5 V 3
Output Current (absolute maximum) IOUT -30 30 A 3
Junction Temperature (absolute maximum) TJ -55 150 °C 3
Storage Temperature (absolute maximum) TSTG -65 150 °C 3
Supply Voltage (recommended operating) VCC 35 V Minimum given as UVLO (not numeric) 4
Operating Temperature Range TA -40 125 °C 4
Input Voltage, High VIH 3.5 V UVLO < VCC < 18V 4
Input Voltage, Low VIL 0.8 V UVLO < VCC < 18V 4
Input Current IIN -10 10 A 0V < VIN < VCC 4
Output Voltage, Low VOL 0.025 V 4
Output Resistance, High State ROH 0.17 0.4 Ω VCC=18V, IOUT= -100mA 4
Output Resistance, Low State ROL 0.16 0.3 Ω VCC=18V, IOUT=100mA 4
Output Current, Continuous IDC -8 8 A Limited by package power dissipation 4
Rise Time tr 11 20 ns CLOAD=5.6nF, VCC=18V 4
Fall Time tf 11 18 ns CLOAD=5.6nF, VCC=18V 4
On-Time Propagation Delay tondly 46 65 ns CLOAD=5.6nF, VCC=18V 4
Off-Time Propagation Delay toffdly 46 65 ns CLOAD=5.6nF, VCC=18V 4
Output Enable Time tPZL, tPZH 34 65 ns IXDD630 only 4
Output Disable Time tPLZ, tPHZ 65 125 ns IXDD630 only 4
Enable Pull-Up Resistor REN 400 k IXDD630 only 4
Power Supply Current (VIN=3.5V) ICC 2.5 4 mA VCC=18V, VIN=3.5V 4
Power Supply Current (VIN=0V) ICC 0.75 mA VCC=18V, VIN=0V 4
Power Supply Current (VIN=VCC) ICC 0.75 mA VCC=18V, VIN=VCC 4
Under-Voltage Lockout Threshold, VCC Rising (IXD_630M) UVLO 7 9 9.9 V VCC Rising, IXD_630M 4
Under-Voltage Lockout Hysteresis (IXD_630M) 1 V IXD_630M 4
Input Voltage, High (-40°C to +125°C) VIH 4 V UVLO < VCC < 18V 5
Input Voltage, Low (-40°C to +125°C) VIL 0.8 V UVLO < VCC < 18V 5
Output Resistance, High State (-40°C to +125°C) ROH 0.6 Ω VCC=18V, IOUT= -100mA 5
Output Resistance, Low State (-40°C to +125°C) ROL 0.45 Ω VCC=18V, IOUT=100mA 5
Rise Time (-40°C to +125°C) tr 35 ns CLOAD=5.6nF, VCC=18V 5
Fall Time (-40°C to +125°C) tf 35 ns CLOAD=5.6nF, VCC=18V 5
On-Time Propagation Delay (-40°C to +125°C) tondly 100 ns CLOAD=5.6nF, VCC=18V 5
Off-Time Propagation Delay (-40°C to +125°C) toffdly 100 ns CLOAD=5.6nF, VCC=18V 5
Thermal Impedance, Junction-to-Ambient (5-Lead TO-263) θJA 46 °C/W IXD_630YI (5-Lead TO-263) 5
Thermal Impedance, Junction-to-Case (5-Lead TO-263) θJC 2 °C/W IXD_630YI (5-Lead TO-263) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 10

CAD (KiCad official)

  • Symbol: IXDD630MYI
  • Footprint: Package_TO_SOT_SMD:TO-263-5_TabPin6
  • 3D model: TO-263-5 (KiCad packages3D, STEP)
  • 3D model files: ixdd630myi-etched.step / ixdd630myi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdd630myi.step / ixdd630myi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (12 pp, sha256 cee013af6c2f43a5, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF