component
OPA2375IDR
Public Made by Adomby adom
Texas Instruments Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownOPA2375IDR
Texas Instruments · Pre-ordered Chips · SOIC-8
OPA2375IDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT1 | output | Output of channel 1. |
| 2 | IN1- | input | Inverting input of channel 1. |
| 3 | IN1+ | input | Noninverting input of channel 1. |
| 4 | V- | power_in | Negative (lowest) supply or ground for single-supply operation. |
| 5 | IN2+ | input | Noninverting input of channel 2. |
| 6 | IN2- | input | Inverting input of channel 2. |
| 7 | OUT2 | output | Output of channel 2. |
| 8 | V+ | power_in | Positive (highest) supply, 1.7 V to 5.5 V total supply range relative to V-. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input offset voltage | VOS | -0.5 | 0.15 | 0.5 | mV | VS = 5.0 V, TA = 25°C | 9 |
| Input offset voltage over temperature | VOS | -0.7 | 0.7 | mV | TA = -40°C to 125°C | 9 | |
| Input offset voltage drift | dVOS/dT | 0.16 | µV/℃ | TA = -40°C to 125°C | 9 | ||
| Power supply rejection ratio | PSRR | 0.7 | 5.8 | μV/V | VCM = V- | 9 | |
| Common-mode rejection ratio, VS = 1.8 V | CMRR | 87 | 100 | dB | VS = 1.8 V, (V-) < VCM < (V+), 1.2 V | 9 | |
| Common-mode rejection ratio, VS = 5.5 V | CMRR | 94 | 110 | dB | VS = 5.5, (V-) < VCM < (V+), 1.2 V | 9 | |
| Open-loop gain, VS = 1.8 V, RL = 2 kΩ | AOL | 107 | 130 | dB | VS= 1.8 V, (V-) + 150 mV < VO < (V+), 150 mV, RL = 2 kΩ to VS/2 | 9 | |
| Open-loop gain, VS = 1.8 V, RL = 10 kΩ | AOL | 110 | 132 | dB | VS = 1.8 V, (V-) + 40m V < VO < (V+), 40 mV, RL = 10 kΩ to VS/2 | 9 | |
| Open-loop gain, VS = 5.5 V, RL = 2 kΩ | AOL | 140 | dB | VS= 5.5 V, (V-) + 150 mV < VO < (V+), 150 mV, RL = 2 kΩ to VS/2 | 9 | ||
| Open-loop gain, VS = 5.5 V, RL = 10 kΩ | AOL | 142 | dB | VS = 5.5 V, (V-) + 40m V < VO < (V+), 40 mV, RL = 10 kΩ to VS/2 | 9 | ||
| Input bias current | IB | 3 | pA | 9 | |||
| Input offset current | IOS | 0.5 | pA | 9 | |||
| Channel separation | 130 | dB | f = 20 kHz | 9 | |||
| Input voltage noise density at 10 kHz | eN | 3.5 | nV/√Hz | f = 10 kHz | 9 | ||
| Input voltage noise density at 1 kHz | eN | 4.6 | nV/√Hz | f = 1 kHz | 9 | ||
| Gain-bandwidth product | GBW | 10 | MHz | 10 | |||
| Slew rate | SR | 4.6 | V/μs | VS = 5.5 V, G = +1, CL = 20 pF | 10 | ||
| Phase margin | 55 | ° | G = +1, RL = 10kΩ, CL = 20 pF | 10 | |||
| Positive rail headroom, RL = 10 kΩ | 5 | 14 | mV | VS = 5.5 V, RL = 10 kΩ | 10 | ||
| Negative rail headroom, RL = 10 kΩ | 5 | 14 | mV | VS = 5.5 V, RL = 10 kΩ | 10 | ||
| Short-circuit current | ISC | 68 | mA | 10 | |||
| Quiescent current per amplifier | IQ | 990 | 1200 | µA | VS = 5.5 V, IO = 0 A | 10 | |
| Quiescent current per amplifier over temperature | IQ | 1250 | µA | VS = 5.5 V, IO = 0 A, TA = -40°C to 125°C | 10 | ||
| Supply voltage | VS | 1.7 | 5.5 | V | (V+), (V-), for OPA2375 and OPA4375; 1.7 V to 1.8 V only recommended for TA = 0 - 85℃ | 7 | |
| Specified temperature | TA | -40 | 125 | °C | 7 | ||
| Supply voltage | VS | 0 | 6 | V | VS = (V+), (V-) | 7 | |
| Signal input pin current | -10 | 10 | mA | 7 | |||
| Operating ambient temperature | TA | -55 | 150 | °C | 7 | ||
| Junction temperature | TJ | 150 | °C | 7 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 7 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | OPA2375: Human-body model (HBM) | 7 | |
| ESD CDM | V(ESD) | -1500 | 1500 | V | All Devices: Charged-device model (CDM) | 7 | |
| Junction-to-ambient thermal resistance | RθJA | 131.1 | °C/W | D (SOIC) 8 pins | 8 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 73.2 | °C/W | D (SOIC) 8 pins | 8 | ||
| Junction-to-board thermal resistance | RθJB | 74.5 | °C/W | D (SOIC) 8 pins | 8 | ||
| Junction-to-top characterization parameter | ψJT | 24.4 | °C/W | D (SOIC) 8 pins | 8 | ||
| Junction-to-board characterization parameter | ψJB | 73.3 | °C/W | D (SOIC) 8 pins | 8 |
CAD (KiCad official)
- Symbol:
OPA2375IDR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
opa2375idr-etched.step/opa2375idr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);opa2375idr.step/opa2375idr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (68 pp, sha256
465a2ce99c0a2cb4, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).