component
1SMB5952BT3G
Public Made by Adomby adom
onsemi Zener Diodes, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdown1SMB5952BT3G
onsemi · Zener Diodes · SMB
1SMB5952BT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode end of the Zener diode, indicated by the polarity band; reverse Zener voltage VZ is 123.5 V min, 130 V nom, 136.5 V max at IZT = 2.9 mA for the 1SMB5952BT3G. |
| 2 | Anode | passive | Anode end of the Zener diode; forward voltage VF is 1.5 V max at IF = 200 mA(dc). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener Voltage | VZ | 123.5 | 130 | 136.5 | V | @ IZT = 2.9 mA, TL = 30°C | 3 |
| Maximum Zener Impedance | ZZT | 450 | Ω | @ IZT = 2.9 mA | 3 | ||
| Maximum Zener Impedance at knee | ZZK | 5000 | Ω | @ IZK = 0.25 mA | 3 | ||
| Reverse Leakage Current | IR | 1 | µA | @ VR = 98.8 V | 3 | ||
| Maximum DC Zener Current | IZM | 11 | mA | 3 | |||
| Forward Voltage | VF | 1.5 | V | @ IF = 200 mA(dc) | 3 | ||
| Zener Voltage Tolerance | -5 | 5 | % | Type numbers listed indicate a tolerance of ±5% | 3 | ||
| Test Current | IZT | 2.9 | mA | 3 | |||
| Maximum Steady State Power Dissipation (lead) | PD | 3 | W | @ TL = 75°C, measured at zero lead length | 1 | ||
| Power Derating above 75°C | 40 | mW/°C | Derate above 75°C | 1 | |||
| Maximum Steady State Power Dissipation (ambient) | PD | 550 | mW | @ TA = 25°C, FR-4 board, recommended footprint | 1 | ||
| Power Derating above 25°C | 4.4 | mW/°C | Derate above 25°C | 1 | |||
| Operating and Storage Temperature Range | TJ, Tstg | -65 | 150 | °C | 1 | ||
| Thermal Resistance, Junction-to-Lead | RθJL | 25 | °C/W | 1 | |||
| Thermal Resistance, Junction-to-Ambient | RθJA | 226 | °C/W | FR-4 board, recommended footprint | 1 | ||
| Maximum Lead Temperature for Soldering | 260 | °C | 10 seconds | 1 |
CAD (KiCad official)
- Symbol:
1SMB5952BT3G - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
1smb5952bt3g-etched.step/1smb5952bt3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1smb5952bt3g.step/1smb5952bt3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (6 pp, sha256
e95f4deeabd8ea97, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).