SI8651AB-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD1	power_in	Side 1 power supply, operating from 2.5 to 5.5 V per the datasheet key features.
2	A1	input	Side 1 digital input, a Schmitt trigger input.
3	A2	input	Side 1 digital input, a Schmitt trigger input.
4	A3	input	Side 1 digital input, a Schmitt trigger input.
5	A4	bidirectional	Side 1 digital input or output.
6	A5	bidirectional	Side 1 digital input or output.
7	EN1	input	Side 1 active high enable, which enables or disables output drive for the Side 1 channels.
8	GND1	power_in	Side 1 ground.
9	GND2	power_in	Side 2 ground.
10	EN2	input	Side 2 active high enable, which enables or disables output drive for the Side 2 channels.
11	B5	bidirectional	Side 2 digital input or output.
12	B4	bidirectional	Side 2 digital input or output.
13	B3	output	Side 2 digital output.
14	B2	output	Side 2 digital output.
15	B1	output	Side 2 digital output.
16	VDD2	power_in	Side 2 power supply, operating from 2.5 to 5.5 V per the datasheet key features.

Key specifications

Parameter	Value
Manufacturer	Skyworks Solutions
Package	SOIC-16
Category	Signal Isolation Devices
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Ambient Operating Temperature	TA	-40	25	125	ºC		9
Supply Voltage VDD1	VDD1	2.5		5.5	V		9
Supply Voltage VDD2	VDD2	2.5		5.5	V		9
Storage Temperature	TSTG	-65		150	ºC		29
Ambient Temperature Under Bias	TA	-40		125	ºC		29
Junction Temperature	TJ			150	°C		29
Supply Voltage	VDD1, VDD2	-0.5		7	V		29
Input Voltage (max = VDD + 0.5 V)	VI	-0.5			V		29
Output Voltage (max = VDD + 0.5 V)	VO	-0.5			V		29
Output Current Drive Channel (All Si86xxxA-x-xx devices)	IO			22	mA		29
Latchup Immunity				100	V/ns	slew rate across GND1 and GND2	29
Lead Solder Temperature (10 s)				260	ºC		29
Maximum Isolation (Input to Output) (1 sec), NB SOIC-16 and SOIC-8 package				4500	VRMS	NB SOIC-16, SOIC-8	29
Maximum Isolation (Input to Output) (1 sec), WB SOIC-16 package				6500	VRMS	WB SOIC-16	29
VDD Undervoltage Threshold (rising)	VDDUV+	1.95	2.24	2.375	V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC; VDD1, VDD2 rising	9
VDD Undervoltage Threshold (falling)	VDDUV-	1.88	2.16	2.325	V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC; VDD1, VDD2 falling	9
VDD Undervoltage Hysteresis	VDDHYS	50	70	95	mV	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC	9
Positive-Going Input Threshold	VT+	1.4	1.67	1.9	V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC; All inputs rising	9
Negative-Going Input Threshold	VT-	1	1.23	1.4	V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC; All inputs falling	9
Input Hysteresis	VHYS	0.38	0.44	0.5	V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC	9
High Level Input Voltage	VIH	2			V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC	9
Low Level Input Voltage	VIL			0.8	V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC	9
High Level Output Voltage (5 V table)	VOH	4.8			V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC; loh = -4 mA	9
High Level Output Voltage (3.3 V table)	VOH	3.1			V	VDD1=3.3 V±10%, VDD2=3.3 V±10%, TA=-40 to 125 ºC; loh = -4 mA	15
High Level Output Voltage (2.5 V table)	VOH	2.3			V	VDD1=2.5 V ±5%, VDD2=2.5 V ±5%, TA=-40 to 125 ºC; loh = -4 mA	20
Low Level Output Voltage	VOL		0.2	0.4	V	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC; lol = 4 mA	9
Input Leakage Current	IL	-10		10	µA	VDD1=5 V±10%, VDD2=5 V±10%, TA=-40 to 125 ºC	9
Maximum Data Rate		0		1	Mbps	All models	13
Minimum Pulse Width				250	ns	All models	13
Propagation Delay	tPHL, tPLH			35	ns	See Figure 4.2	13
Pulse Width Distortion /tPLH, tPHL/	PWD			25	ns	See Figure 4.2	13
Propagation Delay Skew	tPSK(P-P)			40	ns		13
Channel-Channel Skew	tPSK			35	ns		13
Output Rise Time	tr		2.5	4	ns	CL = 15 pF	13
Output Fall Time	tf		2.5	4	ns	CL = 15 pF	13
Common Mode Transient Immunity	CMTI	35	50		kV/µs	VI = VDD or 0 V, VCM = 1500 V	13
Enable to Data Valid	ten1		6	11	ns	See Figure 4.1	13
Enable to Data Tri-State	ten2		8	12	ns	See Figure 4.1	13
Start-up Time	tSU		15	40	µs		14
1 Mbps Supply Current, Si8651Ax VDD1			4.2	5.8	mA	All inputs = 500 kHz square wave, CI = 15 pF on all outputs	12
1 Mbps Supply Current, Si8651Ax VDD2			3.8	5.3	mA	All inputs = 500 kHz square wave, CI = 15 pF on all outputs	12
Thermal Resistance Junction-to-Air, WB SOIC-16	θJA		100		ºC/W	WB SOIC-16	27
Thermal Resistance Junction-to-Air, NB SOIC-16	θJA		105		ºC/W	NB SOIC-16	27

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	PC		4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.	38

CAD (KiCad official)

Symbol: SI8651AB-B-IS1
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16 (KiCad packages3D, STEP)
3D model files: si8651ab-b-is1-etched.step / si8651ab-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8651ab-b-is1.step / si8651ab-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Skyworks Solutions datasheet (47 pp, sha256 00fa9de0a782df1c, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

SI8651AB-B-IS1

Verified SI8651AB-B-IS1

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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