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Contents

README

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XB5307A

XySemi · Battery Management · SOT-23-6

XB5307A from XySemi, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Pin 1 is a no-connect (empty) pin, per the datasheet pin description table.
2 VM input VM is the battery pack negative terminal, with the internal FET switch connected to GND; the VM pin voltage range is -6 to 10 V (absolute maximum).
3 GND power_in Ground pin, connected to the negative terminal of the battery cell; Pin 3 and Pin 6 must be connected together with heavy lines outside the package.
4 NC unconnected Pin 4 is a no-connect (empty) pin, per the datasheet pin description table.
5 VDD power_in IC supply pin; the VDD input voltage is rated -0.3 to 6 V (absolute maximum).
6 GND power_in Ground pin, connected to the negative terminal of the battery cell; Pin 3 and Pin 6 must be connected together with heavy lines outside the package.

Key specifications

Parameter Value
Manufacturer XySemi
Package SOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Overcharge detection voltage VCU 4.25 4.3 4.35 V 3
Overcharge release voltage VCL 4.05 4.1 4.15 V 3
Overdischarge detection voltage VDL 2.3 2.4 2.5 V 3
Overdischarge release voltage VDR 2.9 3 3.1 V 3
Normal operating current consumption IOPE 2.8 6 μA VDD=3.6, VM=0V 3
Power-down current consumption IPDN 1.5 3 μA VDD=2.0V, VM pin floating 3
Internal resistance between VM and VDD RVMD 320 kΩ VDD=2.0V, VM pin floating 3
Internal resistance between VM and GND RVMS 100 kΩ VDD=3.6V, VM=1.0V 3
FET equivalent on-resistance RSS(ON) 40 mΩ VDD=3.6V, IVM=1.0A 4
Overtemperature protection temperature TSHD+ 120 °C 4
Overtemperature protection recovery temperature TSHD- 100 °C 4
Overcharge detection delay time tCU 130 200 mS 4
Overdischarge detection delay time tDL 40 60 mS 4
Overdischarge current 1 detection delay time tIOV 10 20 mS VDD=3.6 4
Load short-circuiting detection delay time tSHORT 75 150 uS VDD=3.6 4
Overdischarge current 1 detection current IIOV1 3 A VDD=3.6 3
Load short-circuiting detection current ISHORT 20 A VDD=3.6 3
Supply voltage (VDD input voltage) VDD -0.3 6 V 2
VM input voltage VM -6 10 V 2
Operating ambient temperature -40 85 °C 3
Maximum junction temperature 125 °C 3
Storage temperature -55 150 °C 3
Lead temperature (soldering) 300 °C soldering, 10 s 3
ESD 2000 V 3
Power dissipation 0.3 W ambient temperature 25°C 3
Thermal resistance, junction to ambient θJA 150 °C/W junction to ambient 3
Package thermal limit (junction temperature) as printed θJA 300 °C/W 3

CAD (KiCad official)

  • Symbol: XB5307A
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: xb5307a-etched.step / xb5307a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xb5307a.step / xb5307a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XySemi datasheet (12 pp, sha256 f06d17ed65df9ebd, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF