component
CL10A226MPCNUBE
Public Made by Adomby adom
SAMSUNG ELECTRO-MECHANICS Global Sourcing Parts, 0603. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownCL10A226MPCNUBE
SAMSUNG ELECTRO-MECHANICS · Global Sourcing Parts · 0603
CL10A226MPCNUBE from SAMSUNG ELECTRO-MECHANICS, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SAMSUNG ELECTRO-MECHANICS |
| Package | 0603 |
| Category | Global Sourcing Parts |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance (M, ±20%) | -20 | 20 | % | 1 | |||
| Capacitance change over temperature (X5R) | -15 | 15 | % | From -55℃ to 85℃ | 2 | ||
| Bending strength capacitance change | -12.5 | 12.5 | % | Bending to the limit (1mm) with 1.0mm/sec | 2 | ||
| Resistance to soldering heat capacitance change | -7.5 | 7.5 | % | Solder pot: 270±5℃, 10±1sec. | 2 | ||
| Vibration test capacitance change | -5 | 5 | % | Amplitude 1.5mm, from 10 Hz to 55 Hz (return 1min.), 2 hours, 3 direction (x, y, z) | 2 | ||
| Moisture resistance capacitance change | -12.5 | 12.5 | % | With rated voltage, 40±2℃, 90~95%RH, 500+12/-0hrs | 2 | ||
| Moisture resistance tan δ (DF) | tan δ (DF) | 0.25 | With rated voltage, 40±2℃, 90~95%RH, 500+12/-0hrs | 2 | |||
| Moisture resistance insulation resistance (500 Mohm branch) | IR | 500 | Mohm | With rated voltage, 40±2℃, 90~95%RH, 500+12/-0hrs; whichever is smaller | 2 | ||
| Moisture resistance insulation resistance (8.8 Mohm·uF branch) | IR | 8.8 | Mohm·uF | With rated voltage, 40±2℃, 90~95%RH, 500+12/-0hrs; whichever is smaller | 2 | ||
| High temperature resistance capacitance change | -12.5 | 12.5 | % | Max. operating temperature, of the rated voltage, 1000+48/-0hrs | 2 | ||
| High temperature resistance tan δ (DF) | tan δ (DF) | 0.25 | Max. operating temperature, of the rated voltage, 1000+48/-0hrs | 2 | |||
| High temperature resistance insulation resistance (1000 Mohm branch) | IR | 1000 | Mohm | Max. operating temperature, of the rated voltage, 1000+48/-0hrs; whichever is smaller | 2 | ||
| High temperature resistance insulation resistance (17.7 Mohm·uF branch) | IR | 17.7 | Mohm·uF | Max. operating temperature, of the rated voltage, 1000+48/-0hrs; whichever is smaller | 2 | ||
| Temperature cycling capacitance change | -10 | 10 | % | 1 cycle condition: Min. operating temperature ױ 25ఁ; Max. operating temperature ױ 25ఁ; 5 cycle test | 2 | ||
| Insulation resistance (10,000 Mohm branch) | IR | 10000 | Mohm | Rated Voltage 60~120 sec., whichever is smaller | 2 | ||
| Insulation resistance (50 Mohm·uF branch) | IR | 50 | Mohm·uF | Rated Voltage 60~120 sec., whichever is smaller | 2 | ||
| Dissipation factor (tan δ) | tan δ (DF) | 0.1 | 120 Hz ±20% 0.5±0.1Vrms | 2 | |||
| Rated voltage | 10 | V | 1 | ||||
| Nominal capacitance | C | 22 | µF | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | * Caution - Iron tip should not contact with ceramic body directly Lead-free solder: Sn-3.0Ag-0.5CU | 24 |
CAD (KiCad official)
- Symbol:
CL10A226MPCNUBE - Footprint:
Capacitor_SMD:C_0603_1608Metric - 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files:
cl10a226mpcnube-etched.step/cl10a226mpcnube-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cl10a226mpcnube.step/cl10a226mpcnube.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SAMSUNG ELECTRO-MECHANICS datasheet (36 pp, sha256
53cafe56d60a76b1, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).