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MDB8S

Public Made by Adom

by adom

onsemi Bridge Rectifiers, TSSOP-4(5.0x4.4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

Schematic Symbol

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PCB Footprint

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Datasheet

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Contents

README

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MDB8S

onsemi · Bridge Rectifiers · TSSOP-4(5.0x4.4)

MDB8S from onsemi, in a TSSOP-4(5.0x4.4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive AC line input 1; one of two single-phase AC inputs to the bridge rectifier, rated up to VRMS = 560 V for MDB8S.
2 + power_out DC positive output; rectified DC rail, VRRM = 800 V, IF(AV) = 1.0 A, IFSM = 30 A, VF max 1.1 V per diode at IF = 1 A.
3 3 passive AC line input 2; one of two single-phase AC inputs to the bridge rectifier, rated up to VRMS = 560 V for MDB8S.
4 - power_in DC negative output (GND/return); negative rail of the rectified output, connects to circuit ground.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-4(5.0x4.4)
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 800 V 2
Maximum RMS Voltage VRMS 560 V 2
Maximum DC Blocking Voltage VDC 800 V 2
Average Rectified Forward Current IF(AV) 1 A Note 1: 60 Hz sine wave, R-load, TA = 25°C on FR-4 PCB 2
Peak Forward Surge Current IFSM 30 A Note 2: 60 Hz sine wave, non-repetitive 1 cycle peak, TJ = 25°C 2
I2t Rating for fusing I2t 3.735 A2S t < 8.3 ms 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Maximum Forward Voltage VF 1.1 V IF = 1 A, pulse measurement, per diode 2
Maximum Reverse Current IR 10 µA At VRRM, pulse measurement, per diode 2
Thermal Resistance, Junction to Ambient, dual dice measurement RθJA 250 °C/W Measurement with dual dice, FR-4 PCB per Note 3 2
Thermal Resistance, Junction to Ambient, single die measurement RθJA 150 °C/W Measurement with single die, FR-4 PCB per Note 3 2
Thermal Characterization, Junction to Lead JL 57 °C/W Pin 2 2
Thermal Characterization, Junction to Lead JL 15 °C/W Pin 1, 3, 4 2

CAD (KiCad official)

  • Symbol: MDB8S
  • Footprint: Package_SO:TSSOP-4_4.4x5mm_P4mm
  • 3D model: TSSOP-4(5.0x4.4) (KiCad packages3D, STEP)
  • 3D model files: mdb8s-etched.step / mdb8s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mdb8s.step / mdb8s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 0a5979023babfdda, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-sonnet-4-6 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF