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Contents

README

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FDS89161LZ-HXY

HXY MOSFET · MOSFETs · SOP-8

FDS89161LZ-HXY from HXY MOSFET, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of the first N-channel MOSFET; the device's continuous source current IS is rated 8A (page 2).
2 G1 input Gate of the first N-channel MOSFET; VGS is rated ±20V, and the device is specified for operation with gate voltages as low as 2.5V.
3 S2 passive Source of the second N-channel MOSFET; the device's continuous source current IS is rated 8A (page 2).
4 G2 input Gate of the second N-channel MOSFET; VGS is rated ±20V.
5 D2 passive Drain of the second N-channel MOSFET; VDS is rated 100V and drain current ID is 8A at TA=25°C.
6 D2 passive Drain of the second N-channel MOSFET (tied to pin 5); VDS is rated 100V and drain current ID is 8A at TA=25°C.
7 D1 passive Drain of the first N-channel MOSFET (tied to pin 8); VDS is rated 100V and drain current ID is 8A at TA=25°C.
8 D1 passive Drain of the first N-channel MOSFET; VDS is rated 100V and drain current ID is 8A at TA=25°C.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 1 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 10 uA VDS=80V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 100 uA VDS=80V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS 8 A VG=VD=0V, Force Current 2
Pulsed Source Current ISM 12 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=1A, TJ=25℃ 2
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS 20 V 1
Drain Current ID@TA=25℃ 8 A VGS @ 4.5V 1
Drain Current ID@TA=70℃ 5 A VGS @ 4.5V 1
Pulsed Drain Current IDM 15 A 1
Total Power Dissipation PD@TA=25℃ 1.5 W 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Maximum Thermal Resistance, Junction-ambient Rthj-a 85 ℃/W 1

CAD (KiCad official)

  • Symbol: FDS89161LZ-HXY
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: fds89161lz-hxy-etched.step / fds89161lz-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fds89161lz-hxy.step / fds89161lz-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 208420fb44ec3f58, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF