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Contents

README

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NCE60P12AS

Wuxi NCE Power Semiconductor · MOSFETs · SOP-8

NCE60P12AS from Wuxi NCE Power Semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the P-channel MOSFET; the drain-source voltage rating is -60V.
2 S passive Source of the P-channel MOSFET; the drain-source voltage rating is -60V.
3 S passive Source of the P-channel MOSFET; the drain-source voltage rating is -60V.
4 G input Gate of the P-channel MOSFET; the maximum gate-source voltage is ±20V.
5 D passive Drain of the P-channel MOSFET; continuous drain current is -12A and pulsed drain current is -50A.
6 D passive Drain of the P-channel MOSFET; continuous drain current is -12A and pulsed drain current is -50A.
7 D passive Drain of the P-channel MOSFET; continuous drain current is -12A and pulsed drain current is -50A.
8 D passive Drain of the P-channel MOSFET; continuous drain current is -12A and pulsed drain current is -50A.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID -12 A 1
Drain Current-Continuous ID (100℃) -8.5 A TC=100℃ 1
Pulsed Drain Current IDM -50 A 1
Maximum Power Dissipation PD 3.5 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 35 ℃/W Note 2: surface mounted on FR4 board, t ≤ 10 sec 1
Drain-Source Breakdown Voltage BVDSS -60 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=-60V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -1.2 -1.8 -2.5 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(ON) 11 14 mΩ VGS=-10V, ID=-12A 2
Drain-Source On-State Resistance RDS(ON) 13 17 mΩ VGS=-4.5V, ID=-12A 2
Diode Forward Voltage VSD -1.2 V VGS=0V,IS=-12A 2
Diode Forward Current IS -12 A 2

CAD (KiCad official)

  • Symbol: NCE60P12AS
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: nce60p12as-etched.step / nce60p12as-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce60p12as.step / nce60p12as.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 d3e9d26dad1f119b, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF