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Contents

README

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LM2574MX-3.3

Texas Instruments · DC-DC Converters · SOIC-14-300mil

LM2574MX-3.3 from Texas Instruments, in a SOIC-14-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.
2 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.
3 FB input Feedback sense input pin connecting to the midpoint of the feedback divider to set VOUT for the adjustable version or directly to the output capacitor for the fixed output version.
4 SIG_GND power_in Signal ground pin serving as the ground reference for internal references and logic, requiring connection to system ground.
5 ON/OFF input Enable input to the voltage regulator with high level disabling and low level enabling the regulator, and must not be left floating.
6 PWR_GND power_in Power ground pins connecting to system ground and ground pins of CIN and COUT with the path to CIN kept as short as possible.
7 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.
8 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.
9 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.
10 VIN power_in Supply input pin to the collector of the high-side transistor requiring connection to power supply and input bypass capacitors CIN with path to CIN and PWR_GND kept as short as possible.
11 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.
12 OUTPUT output Emitter pin of the power transistor serving as a switching node that attaches to an inductor and the cathode of the external diode.
13 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.
14 NC unconnected No internal connection, but must be soldered to PCB for best heat transfer.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-14-300mil
Category Power Management (PMIC)
Pins 14

CAD (KiCad official)

  • Symbol: LM2574MX-3.3
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14-300mil (KiCad packages3D, STEP)
  • 3D model files: lm2574mx-3-3-etched.step / lm2574mx-3-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2574mx-3-3.step / lm2574mx-3-3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 61a9f44cec6689e8, retrieved 2026-09-24, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF