component
BL3H7C
Public Made by Adomby adom
GME(银河微电) , SSOP-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBL3H7C
GME(银河微电) · IC · SSOP-4
BL3H7C from GME(银河微电), in a SSOP-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | input | LED anode of the input side; forward current IF max 50 mA (IFM 1 A peak, VF typ 1.2 V at IF = 20 mA), reverse voltage VR max 6 V. |
| 2 | Cathode | passive | LED cathode of the input side, returned to the input ground; forward current IF max 50 mA and reverse voltage VR max 6 V. |
| 3 | Emitter | passive | Phototransistor emitter of the output side; emitter-collector voltage VECO max 7 V. |
| 4 | Collector | passive | Phototransistor collector of the output side; collector-emitter voltage VCEO max 80 V and collector current IC max 50 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GME(银河微电) |
| Package | SSOP-4 |
| Category | |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward Voltage | VF | 1.2 | 1.4 | V | IF = 20mA | 3 | |
| Peak Forward Voltage | VFM | 3 | V | IFM = 0.5A | 3 | ||
| Reverse Current | IR | 10 | μA | VR = 4V | 3 | ||
| Input Capacitance | Cin | 30 | 250 | pF | VR = 0V, f = 1kHz | 3 | |
| Collector-Emitter Dark Current | ICEO | 100 | nA | VCE = 20V, IF = 0 | 3 | ||
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | IC = 0.1mA, IF = 0 | 3 | ||
| Emitter-Collector Breakdown Voltage | BVECO | 7 | V | IE = 10μA, IF = 0 | 3 | ||
| Collector Current | IC | 2.5 | 30 | mA | IF = 5mA, VCE = 5V | 3 | |
| Current Transfer Ratio (rank C) | CTR | 200 | 400 | % | IF = 5 mA, VCE = 5V | 4 | |
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.1 | 0.2 | V | IF = 20mA, IC = 1mA | 3 | |
| Isolation Current | Risc | 2 | μA | DC6000V, 40~60% R.H. | 3 | ||
| Floating Capacitance | CIO | 0.6 | 1 | pF | VIO = 0, f = 1MHz | 3 | |
| Turn On Time | Ton | 4 | 18 | μs | VCE = 2V, RL = 100Ω, IC = 2mA | 4 | |
| Turn Off Time | Toff | 3 | 18 | μs | VCE = 2V, RL = 100Ω, IC = 2mA | 4 | |
| Input Forward Current | IF | 50 | mA | 2 | |||
| Peak Forward Current | IFM | 1 | A | Pulse width ≤1μs, Duty ratio: 0.001 | 2 | ||
| Reverse Voltage | VR | 6 | V | 2 | |||
| Input Power Dissipation | PD | 70 | mW | 2 | |||
| Collector Power Dissipation | PC | 150 | mW | 2 | |||
| Collector Current | IC | 50 | mA | 2 | |||
| Collector-Emitter Voltage | VCEO | 80 | V | 2 | |||
| Emitter-Collector Voltage | VECO | 7 | V | 2 | |||
| Total Power Dissipation | PTOT | 200 | mW | 3 | |||
| Isolation Voltage | VISO | 3750 | Vrms | 40 to 60% RH, AC for 1 minute | 3 | ||
| Rated Impulse Isolation Voltage | VIOTM | 5000 | V | 3 | |||
| Rated Repetitive Peak Isolation Voltage | VIORM | 600 | V | 3 | |||
| Operating Temperature | TOPR | -55 | 110 | °C | 3 | ||
| Storage Temperature Range | TSTG | -55 | 125 | °C | 3 | ||
| Soldering Temperature | TSOL | 260 | °C | For 10 seconds | 3 | ||
| Thermal Resistance Junction-to-Air | RθJA | 430 | °C/W | 3 | |||
| Thermal Resistance Junction-to-Case | RθJC | 350 | °C/W | 3 | |||
| Thermal Resistance Junction-to-Lead | RθJL | 368 | °C/W | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte tin-plated leads; solderability-per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
BL3H7C - Footprint:
Package_SO:SSOP-4_4.4x2.6mm_P1.27mm - 3D model: SSOP-4, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.75 mm nominal SSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
bl3h7c-etched.step/bl3h7c-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bl3h7c.step/bl3h7c.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GME(银河微电) datasheet (9 pp, sha256
bb544b4d57ab17be, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).