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3040K
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Shenzhen Fuman MOSFETs, TO-252-2. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdown3040K
Shenzhen Fuman · MOSFETs · TO-252-2
3040K from Shenzhen Fuman, in a TO-252-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS rated at ±20 V maximum and a threshold of 1.0 V min to 2.5 V max at ID=250μA. |
| 2 | D | passive | Drain, the center lead, which is also the exposed tab; VDS is rated at 30 V maximum and continuous ID at 40 A at TC=25℃. |
| 3 | S | passive | Source; the body diode runs from source to drain, with a continuous forward current of 40 A maximum. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Fuman |
| Package | TO-252-2 |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | V(BR)DSS | 30 | V | VGS=0V, ID=250μA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | VDS=30V, VGS=0V | 2 | ||
| Gate Leakage Current, Forward | IGSSF | 100 | nA | VDS=0V, VGS=20V | 2 | ||
| Gate Leakage Current, Reverse | IGSSR | -100 | nA | VDS=0V, VGS=-20V | 2 | ||
| Gate Threshold Voltage | VGS(th) | 1 | 1.6 | 2.5 | V | VDS=VGS, ID=250μA | 2 |
| Static Drain-Source On-Resistance | RDS(on) | 5.8 | 7.5 | mΩ | VGS=10V, ID=20A | 2 | |
| Static Drain-Source On-Resistance | RDS(on) | 10.5 | 13.5 | mΩ | VGS=4.5V, ID=15A | 2 | |
| Forward Transconductance | gFS | 20 | S | VDS = 5 V, ID = 15 A (Note 3) | 2 | ||
| Maximum Continuous Drain to Source Diode Forward Current | IS | 40 | A | 2 | |||
| Maximum Pulsed Drain to Source Diode Forward Current | ISM | 135 | A | 2 | |||
| Drain to Source Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=40A | 2 | ||
| Drain-Source Voltage | VDS | 30 | V | TC=25℃ | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TC=25℃ | 1 | |
| Continuous Drain Current | ID | 40 | A | TC = 25℃ | 1 | ||
| Continuous Drain Current | ID | 26 | A | TC = 100℃ | 1 | ||
| Pulsed Drain Current | IDM | 135 | A | note1 | 1 | ||
| Single Pulsed Avalanche Energy | EAS | 80 | mJ | note2 | 1 | ||
| Power Dissipation | PD | 50 | W | TC = 25℃ | 1 | ||
| Power Dissipation Derating | PD | 0.53 | W/℃ | TC = 25℃ | 1 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 175 | ℃ | 1 | ||
| Thermal Resistance, Junction to Case | RθJC | 1.83 | ℃/W | 1 | |||
| Input Capacitance | Ciss | 1019 | pF | VDS=15V, VGS=0V, f=1.0MHz | 2 | ||
| Output Capacitance | Coss | 166 | pF | VDS=15V, VGS=0V, f=1.0MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 141 | pF | VDS=15V, VGS=0V, f=1.0MHz | 2 | ||
| Total Gate Charge | Qg | 19 | nC | VDS=15V, ID=20A, VGS=10V | 2 | ||
| Gate-Source Charge | Qgs | 6.3 | nC | VDS=15V, ID=20A, VGS=10V | 2 | ||
| Gate-Drain Charge | Qgd | 4.5 | nC | VDS=15V, ID=20A, VGS=10V | 2 | ||
| Turn-on Delay Time | td(on) | 6 | ns | VDD=15V, ID=12A, VGS=10V, RG=6Ohm | 2 | ||
| Turn-on Rise Time | tr | 24 | ns | VDD=15V, ID=12A, VGS=10V, RG=6Ohm | 2 | ||
| Turn-off Delay Time | td(off) | 28 | ns | VDD=15V, ID=12A, VGS=10V, RG=6Ohm | 2 | ||
| Turn-off Fall Time | tf | 27 | ns | VDD=15V, ID=12A, VGS=10V, RG=6Ohm | 2 | ||
| Body Diode Reverse Recovery Time | trr | 21 | ns | IF=12A, dI/dt=100A/μs | 2 | ||
| Body Diode Reverse Recovery Charge | Qrr | 9 | nC | IF=12A, dI/dt=100A/μs | 2 |
CAD (KiCad official)
- Symbol:
3040K - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2 (KiCad packages3D, STEP)
- 3D model files:
3040k-etched.step/3040k-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);3040k.step/3040k.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Fuman datasheet (4 pp, sha256
ce287992522ba5d0, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).