Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

AP2315GEN

APEC(Advanced Power Elec) · MOSFETs · SOT-23

AP2315GEN from APEC(Advanced Power Elec), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; drive with VGS limited to ±16V, with threshold VGS(th) of -1 to -3V at ID=-250uA.
2 S passive Source of the P-channel MOSFET; continuous drain current is -840mA at TA=25°C (VGS @ 10V).
3 D passive Drain; drain-source voltage rating is -30V, with pulsed drain current of -2.5A.

Key specifications

Parameter Value
Manufacturer APEC(Advanced Power Elec)
Package SOT-23
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS=0V, ID=-250uA 2
Static Drain-Source On-Resistance RDS(ON) 1.25 Ω VGS=-10V, ID=-0.8A 2
Static Drain-Source On-Resistance RDS(ON) 2.4 Ω VGS=-4.5V, ID=-0.5A 2
Gate Threshold Voltage VGS(th) -1 -3 V VDS=VGS, ID=-250uA 2
Drain-Source Leakage Current IDSS -1 uA VDS=-30V, VGS=0V 2
Gate-Source Leakage IGSS 30 uA VGS=+16V, VDS=0V 2
Total Gate Charge Qg 1 1.6 nC ID=-0.8A 2
Input Capacitance Ciss 30 50 pF VGS=0V 2
Forward On Voltage VSD -1.3 V IS=-1.1A, VGS=0V 2
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS 16 V 1
Drain Current, VGS @ 10V (TA=25℃) ID@TA=25℃ -840 mA VGS @ 10V 1
Drain Current, VGS @ 10V (TA=70℃) ID@TA=70℃ -670 mA VGS @ 10V 1
Pulsed Drain Current IDM -2.5 A Pulse width limited by Max. junction temperature 1
Total Power Dissipation PD@TA=25℃ 0.69 W TA=25℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Maximum Thermal Resistance, Junction-ambient Rthj-a 180 ℃/W 1
Maximum Thermal Resistance, Junction-ambient (minimum copper pad) Rthj-a 400 ℃/W when mounted on min. copper pad 2

CAD (KiCad official)

  • Symbol: AP2315GEN
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: ap2315gen-etched.step / ap2315gen-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2315gen.step / ap2315gen.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: APEC(Advanced Power Elec) datasheet (5 pp, sha256 ca75720bf57abf9e, retrieved 2026-11-06, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF