component
SMBJ33AHE3_A
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Vishay Intertech TVS, SMB(DO-214AA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMBJ33AHE3_A
Vishay Intertech · TVS · SMB(DO-214AA)
SMBJ33AHE3_A from Vishay Intertech, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal of the uni-directional SMBJ33A, marked by the cathode band, with VWM 33 V, VBR 36.7 V to 40.6 V at 1.0 mA and maximum clamping voltage 53.3 V at 11.3 A. |
| 2 | A | passive | Anode terminal at the end opposite the cathode band, for 600 W (10/1000 μs) transient suppression on the SMBJ33A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | VBR | 36.7 | 40.6 | V | at IT = 1.0 mA, TA = 25 °C | 2 | |
| Stand-off voltage | VWM | 33 | V | 2 | |||
| Maximum reverse leakage at VWM | ID | 1 | μA | at VWM | 2 | ||
| Maximum peak pulse surge current | IPPM | 11.3 | A | 10/1000 μs waveform | 2 | ||
| Maximum clamping voltage at IPPM | VC | 53.3 | V | at IPPM | 2 | ||
| Forward voltage (uni-directional only) | VF | 3.5 | V | IF = 50 A | 2 | ||
| Peak pulse power dissipation | PPPM | 600 | W | 10/1000 μs waveform | 1 | ||
| Peak forward surge current | IFSM | 100 | A | 8.3 ms single half sine-wave, uni-directional only | 1 | ||
| Operating junction and storage temperature range | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Thermal resistance, junction to ambient | RθJA | 100 | °C/W | Mounted on minimum recommended pad layout | 3 | ||
| Thermal resistance, junction to lead | RθJL | 20 | °C/W | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
CAD (KiCad official)
- Symbol:
SMBJ33AHE3_A - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
smbj33ahe3-a-etched.step/smbj33ahe3-a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj33ahe3-a.step/smbj33ahe3-a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (5 pp, sha256
13281d4fec098228, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).