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Contents

README

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BSS83PH6327-HXY

HXY MOSFET · MOSFETs · SOT-23

BSS83PH6327-HXY from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the P-channel MOSFET, with gate-source voltage limited to ±20 V and RDS(ON) specified at VGS=-10V and -4.5V.
2 S passive Source of the P-channel MOSFET, the reference terminal for gate drive; continuous drain current is -2 A.
3 D passive Drain of the P-channel MOSFET, rated for a drain-source voltage of -60 V and a continuous current of -2 A (-8 A pulsed).

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID -2 A 1
Drain Current-Pulsed IDM -8 A Repetitive rating, pulse width limited by maximum junction temperature (Note 1) 1
Maximum Power Dissipation PD 1.5 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -1.4 -2 -2.6 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(ON) 160 180 mΩ VGS=-10V, ID=-1.5A 2
Drain-Source On-State Resistance RDS(ON) 185 200 mΩ VGS=-4.5V, ID=-1.5A 2
Drain-Source Breakdown Voltage BVDSS -60 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-60V,VGS=0V 2
Diode Forward Current IS -1.6 A 2
Thermal Resistance, Junction-to-Ambient RθJA 83.3 ℃/W Surface mounted on FR4 board, t ≤ 10 sec (Note 2) 1

CAD (KiCad official)

  • Symbol: BSS83PH6327-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bss83ph6327-hxy-etched.step / bss83ph6327-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bss83ph6327-hxy.step / bss83ph6327-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (7 pp, sha256 824744f762f45794, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF