Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

DHE1J

MDD(Microdiode Electronics) · Fast Recovery / High Efficiency Diodes · SOD-123FL

DHE1J from MDD(Microdiode Electronics), in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MDD(Microdiode Electronics)
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 600 V 1
Maximum RMS voltage VRMS 420 V 1
Maximum DC blocking voltage VDC 600 V 1
Maximum average forward rectified current I(AV) 1 A Ta=65°C 1
Peak forward surge current IFSM 25 A 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) 1
Maximum DC reverse current IR 5 μA TA=25℃ at rated DC blocking voltage 1
Maximum DC reverse current IR 100 μA TA=100℃ at rated DC blocking voltage 1
Typical junction capacitance CJ 25 pF NOTE 1 1
Maximum reverse recovery time trr 50 ns NOTE 2 1
Typical thermal resistance, junction to ambient RJA 180 ℃/W NOTE 3: PCB mounted on 0.20.2" (5.05.0mm) copper pad area 1
Operating junction temperature range TJ -55 125 ℃ 1
Storage temperature range TSTG -55 150 ℃ 1

CAD (KiCad official)

  • Symbol: DHE1J
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: dhe1j-etched.step / dhe1j-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dhe1j.step / dhe1j.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD(Microdiode Electronics) datasheet (3 pp, sha256 e27d9d7ada5999b8, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF