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PIC16F1827-I

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Microchip Tech MICROCHIP, SOIC-18-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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PIC16F1827-I

Microchip Tech · MICROCHIP · SOIC-18-300mil

PIC16F1827-I from Microchip Tech, in a SOIC-18-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RA2 bidirectional General purpose I/O that is also the A/D channel 2 input, a comparator C1/C2 input (C12IN2-, C12IN+), the A/D negative reference (VREF-) and the DAC voltage output (DACOUT).
2 RA3 bidirectional General purpose I/O that is also A/D channel 3, the A/D positive reference input (VREF+), a comparator C1 input and output (C1IN+, C1OUT), CCP3 and the SR latch non-inverting output (SRQ).
3 RA4 bidirectional General purpose I/O that is also A/D channel 4, the Timer0 clock input (T0CKI), comparator C2 output (C2OUT), CCP4 and the SR latch inverting output (SRNQ).
4 RA5 input Input-only pin that serves as the MCLR master clear with internal pull-up or as the VPP high-voltage programming input.
5 VSS power_in Ground reference for the device.
6 RB0 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also the external interrupt INT, Timer1 gate T1G, CCP1/P1A, SR latch input SRI and ECCP auto-shutdown input FLT0.
7 RB1 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also A/D channel 11, capacitive sensing input CPS11, EUSART RX/DT, I2C SDA1 and SPI data input SDI1.
8 RB2 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also A/D channel 10, capacitive sensing input CPS10, modulator input MDMIN, EUSART TX/CK/RX/DT, I2C SDA2, SPI SDI2 and SDO1.
9 RB3 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also A/D channel 9, capacitive sensing input CPS9, modulator output MDOUT, CCP1 and P1A.
10 RB4 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also A/D channel 8, capacitive sensing input CPS8, I2C SCL1, SPI clock SCK1 and modulator carrier input MDCIN2.
11 RB5 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also A/D channel 7, capacitive sensing input CPS7, PWM output P1B, EUSART TX/CK, I2C SCL2, SPI SCK2 and SPI slave select SS1.
12 RB6 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also A/D channel 5, capacitive sensing input CPS5, Timer1 clock T1CKI, Timer1 oscillator T1OSI, PWM outputs P1C/P2A, CCP2 and the ICSP serial programming clock ICSPCLK.
13 RB7 bidirectional General purpose I/O with individually controlled interrupt-on-change and pull-up, also A/D channel 6, capacitive sensing input CPS6, Timer1 oscillator T1OSO, PWM outputs P1D/P2B, modulator carrier input MDCIN1 and the ICSP data I/O ICSPDAT.
14 VDD power_in Positive supply for the device.
15 RA6 bidirectional General purpose I/O that is also the OSC2 crystal connection (LP, XT, HS modes), CLKOUT (FOSC/4), the clock reference output CLKR, PWM outputs P1D/P2B and EUSART SPI data output SDO1.
16 RA7 bidirectional General purpose I/O that is also the OSC1 crystal connection (LP, XT, HS modes), the external clock input CLKIN (EC mode), PWM outputs P1C/P2A and CCP2.
17 RA0 bidirectional General purpose I/O that is also A/D channel 0, capacitive sensing input CPS0, comparator C1/C2 negative input (C12IN0-) and SPI data output SDO2.
18 RA1 bidirectional General purpose I/O that is also A/D channel 1, capacitive sensing input CPS1, comparator C1/C2 negative input (C12IN1-) and SPI slave select input SS2.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-18-300mil
Category Embedded Processors & Controllers
Pins 18

CAD (KiCad official)

  • Symbol: PIC16F1827-I
  • Footprint: Package_SO:SOIC-18W_7.5x11.6mm_P1.27mm
  • 3D model: SOIC-18-300mil (KiCad packages3D, STEP)
  • 3D model files: pic16f1827-i-etched.step / pic16f1827-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f1827-i.step / pic16f1827-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (406 pp, sha256 0e7915da61b6eca2, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF