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AT25DF081A-SSH-T
Public Made by Adomby adom
Adesto Technologies NOR FLASH, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAT25DF081A-SSH-T
Adesto Technologies · NOR FLASH · SOIC-8
AT25DF081A-SSH-T from Adesto Technologies, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Chip select, active low: asserting CS selects the device, and deasserting it deselects the device into standby (not Deep Power-Down) with SO high-impedance and SI ignored. |
| 2 | SO (SOI) | bidirectional | Serial output clocked out on the falling edge of SCK, becoming an input (SOI) during Dual-Input Byte/Page Program, and high-impedance whenever CS is deasserted. |
| 3 | WP | input | Write protect, internally pulled high, controls the hardware locking of protected sectors and is recommended to be externally connected to VCC whenever possible. |
| 4 | GND | power_in | Ground reference for the power supply, which should be connected to the system ground. |
| 5 | SI (SIO) | bidirectional | Serial input latched on the rising edge of SCK, becoming an output (SIO) during Dual-Output Read Array, and ignored whenever the device is deselected. |
| 6 | SCK | input | Serial clock controlling data flow: command, address and input data on SI are latched on the rising edge of SCK, and output data on SO is clocked out on the falling edge. |
| 7 | HOLD | input | Temporarily pauses serial communication while asserted with SO high-impedance, internally pulled high, and requires CS asserted and SCK low to start a Hold condition. |
| 8 | VCC | power_in | Supplies the source voltage to the device within 2.7V to 3.6V; operations at invalid VCC voltages may produce spurious results and should not be attempted. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Adesto Technologies |
| Package | SOIC-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature (Case) Ind. | -40 | 85 | °C | 43 | |||
| VCC Power Supply | VCC | 2.7 | 3.6 | V | 43 | ||
| Temperature under Bias | -55 | 125 | °C | 43 | |||
| Storage Temperature | -65 | 150 | °C | 43 | |||
| All Input Voltages (including NC Pins) with Respect to Ground | -0.6 | 4.1 | V | with respect to ground | 43 | ||
| Standby Current | ISB | 25 | 50 | µA | CS, WP, HOLD = VCC, all inputs at CMOS levels | 43 | |
| Deep Power-down Current | IDPD | 5 | 10 | µA | CS, WP, HOLD = VCC, all inputs at CMOS levels | 43 | |
| Active Current, Read Operation | ICC1 | 17 | 20 | mA | f = 100MHz; IOUT = 0mA; CS = VIL, VCC = Max | 43 | |
| Active Current, Read Operation | ICC1 | 16 | 19 | mA | f = 85MHz; IOUT = 0mA; CS = VIL, VCC = Max | 43 | |
| Active Current, Read Operation | ICC1 | 15 | 18 | mA | f = 66MHz; IOUT = 0mA; CS = VIL, VCC = Max | 43 | |
| Active Current, Read Operation | ICC1 | 14 | 17 | mA | f = 50MHz; IOUT = 0mA; CS = VIL, VCC = Max | 43 | |
| Active Current, Read Operation | ICC1 | 13 | 16 | mA | f = 33MHz; IOUT = 0mA; CS = VIL, VCC = Max | 43 | |
| Active Current, Read Operation | ICC1 | 12 | 15 | mA | f = 20MHz; IOUT = 0mA; CS = VIL, VCC = Max | 43 | |
| Active Current, Program Operation | ICC2 | 10 | 15 | mA | CS = VCC, VCC = Max | 43 | |
| Active Current, Erase Operation | ICC3 | 12 | 18 | mA | CS = VCC, VCC = Max | 43 | |
| Input Leakage Current | ILI | 1 | µA | VIN = CMOS levels | 43 | ||
| Output Leakage Current | ILO | 1 | µA | VOUT = CMOS levels | 43 | ||
| Output Low Voltage | VOL | 0.4 | V | IOL = 1.6mA; VCC = Min | 43 | ||
| Maximum Clock Frequency for All Operations, RapidS Operation Only | fMAX | 100 | MHz | excluding 0Bh, 03h, 3Bh, and 9F opcodes | 44 | ||
| Maximum Clock Frequency for All Operations | fCLK | 85 | MHz | excluding 03h and 3Bh opcodes | 44 | ||
| Maximum Clock Frequency for 03h Opcode (Read Array, Low Frequency) | fRDLF | 50 | MHz | 03h opcode | 44 | ||
| Maximum Clock Frequency for 3Bh Opcode (Dual-Output Read) | fRDDO | 85 | MHz | 3Bh opcode | 44 | ||
| Clock High Time | tCLKH | 4.3 | ns | 44 | |||
| Clock Low Time | tCLKL | 4.3 | ns | 44 | |||
| Clock Rise Time, Peak-to-Peak (Slew Rate) | tCLKR | 0.1 | V/ns | 44 | |||
| Clock Fall Time, Peak-to-Peak (Slew Rate) | tCLKF | 0.1 | V/ns | 44 | |||
| Chip Select High Time | tCSH | 50 | ns | 44 | |||
| Chip Select Low Setup Time (relative to Clock) | tCSLS | 5 | ns | 44 | |||
| Chip Select Low Hold Time (relative to Clock) | tCSLH | 5 | ns | 44 | |||
| Chip Select High Setup Time (relative to Clock) | tCSHS | 5 | ns | 44 | |||
| Chip Select High Hold Time (relative to Clock) | tCSHH | 5 | ns | 44 | |||
| Data In Setup Time | tDS | 2 | ns | 44 | |||
| Data In Hold Time | tDH | 1 | ns | 44 | |||
| Output Disable Time | tDIS | 5 | ns | 44 | |||
| Output Valid Time | tV | 5 | ns | 15pF load at frequencies above 70MHz, 30pF otherwise | 44 | ||
| Output Hold Time | tOH | 2 | ns | 44 | |||
| HOLD Low Setup Time (relative to Clock) | tHLS | 5 | ns | 44 | |||
| HOLD Low Hold Time (relative to Clock) | tHLH | 5 | ns | 44 | |||
| HOLD High Setup Time (relative to Clock) | tHHS | 5 | ns | 44 | |||
| HOLD High Hold Time (relative to Clock) | tHHH | 5 | ns | 44 | |||
| HOLD Low to Output High-Z | tHLQZ | 5 | ns | 44 | |||
| HOLD High to Output Low-Z | tHHQX | 5 | ns | 44 | |||
| Write Protect Setup Time | tWPS | 20 | ns | 44 | |||
| Write Protect Hold Time | tWPH | 100 | ns | 44 | |||
| Sector Protect Time (from Chip Select High) | tSECP | 20 | ns | from Chip Select High | 44 | ||
| Sector Unprotect Time (from Chip Select High) | tSECUP | 20 | ns | from Chip Select High | 44 | ||
| Sector Lockdown and Freeze Sector Lockdown State Time (from Chip Select High) | tLOCK | 200 | µs | from Chip Select High | 44 | ||
| Chip Select High to Deep Power-Down | tEDPD | 1 | µs | 44 | |||
| Chip Select High to Standby Mode | tRDPD | 30 | µs | 44 | |||
| Reset Time | tRST | 30 | µs | 44 | |||
| Page Program Time (256-Bytes) | tPP | 1 | 3 | ms | 45 | ||
| Block Erase Time 4-Kbytes | tBLKE | 50 | 200 | ms | 4-Kbytes | 45 | |
| Block Erase Time 32-Kbytes | tBLKE | 250 | 600 | ms | 32-Kbytes | 45 | |
| Block Erase Time 64-Kbytes | tBLKE | 400 | 950 | ms | 64-Kbytes | 45 | |
| Chip Erase Time | tCHPE | 16 | 28 | sec | 45 | ||
| OTP Security Register Program Time | tOTPP | 200 | 500 | µs | 45 | ||
| Write Status Register Time | tWRSR | 200 | ns | 45 | |||
| Minimum VCC to Chip Select Low Time | tVCSL | 100 | µs | 45 | |||
| Power-up Device Delay Before Program or Erase Allowed | tPUW | 10 | ms | 45 | |||
| Power-on Reset Voltage | VPOR | 1.5 | 2.5 | V | 45 |
CAD (KiCad official)
- Symbol:
AT25DF081A-SSH-T - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
at25df081a-ssh-t-etched.step/at25df081a-ssh-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);at25df081a-ssh-t.step/at25df081a-ssh-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Adesto Technologies datasheet (53 pp, sha256
010d77c4b76447aa, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusoff(skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).