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Contents

README

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PN7706SPC-R1

Wuxi Chipown Micro electronics · Brushed DC Motor Drivers · SOP-8-EP

PN7706SPC-R1 from Wuxi Chipown Micro electronics, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FAULT output Fault status output that is pulled to GND during undervoltage lockout, over-temperature, or output short-circuit events and returns to high impedance after recovery; it is rated 0 to 5.5 V in operation and -0.3 to 7 V absolute maximum.
2 IN1 input Input signal 1 that controls OUT1, compatible with 5 V and 3.3 V logic with VIH minimum 1.8 V and VIL maximum 0.5 V, operating range 0 to 5.5 V and absolute maximum -0.3 to 7 V.
3 IN2 input Input signal 2 that controls OUT2, compatible with 5 V and 3.3 V logic with VIH minimum 1.8 V and VIL maximum 0.5 V, operating range 0 to 5.5 V and absolute maximum -0.3 to 7 V.
4 ISET passive Drive current limit programming pin that may be left floating (3 A limit) or grounded (1.5 A limit), or connected to GND through a resistor between 27 kΩ and 120 kΩ to set a limit between 1.5 A and 3 A.
5 GND power_in Ground reference pin for the device, which must be connected to the ground plane of the load per the layout guidance.
6 OUT2 output H-bridge output 2 driving the motor, with an absolute maximum rating of -0.7 to 36 V.
7 OUT1 output H-bridge output 1 driving the motor, with an absolute maximum rating of -0.7 to 36 V.
8 VCC power_in Supply pin with an operating range of 2.7 V to 24 V and an absolute maximum rating of -0.3 to 36 V.
9 Thermal Pad passive Exposed heat-sink pad that should be soldered to the PCB top-layer ground pad to conduct heat away from the package, as recommended in the layout guidance.

Key specifications

Parameter Value
Manufacturer Wuxi Chipown Micro electronics
Package SOP-8-EP
Category Motor Driver ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC pin withstand voltage -0.3 36 V 3
IN1, IN2, FAULT pin withstand voltage -0.3 7 V 3
OUT1, OUT2 pin withstand voltage -0.7 36 V 3
ESD capability, human body model -2 2 kV HBM 3
Storage temperature range -55 150 °C 3
Pin soldering temperature 260 °C 10 s 3
VCC supply voltage VCC 2.7 24 V 3
IN1, IN2, FAULT voltage 0 5.5 V 3
Operating ambient temperature -40 125 °C 3
VCC startup voltage VCCON 2.5 2.7 2.9 V 3
VCC undervoltage protection threshold VCCOFF 2.3 2.5 2.7 V 3
VCC operating current IVCC 1.5 mA forward or reverse mode 3
VCC sleep mode current IVCCSLEEP 10 uA VCC=24V, IN1=IN2=0V 3
Startup wake-up time TWAKE 40 80 us VCC>VCCON, IN1 or IN2 high 3
VCC breakdown voltage BVVCC 36 V IVCC=2mA 3
IN valid high-level input voltage VIH 1.8 V 3
IN valid low-level input voltage VIL 0.5 V 3
Pull-down resistance RPD 150 200 250 kΩ RPD = VIN/IIH 3
Input low leakage current IIL 1 uA VIN=0V 3
Input high leakage current IIH 20 25 30 uA VIN=5V 3
Drive max current limit threshold ILIMIT_MAX 3 A ISET open 4
Drive min current limit threshold ILIMIT_MIN 1.5 A ISET grounded 4
Startup maximum current limit threshold TLIMIT_MAX 3 A within 100 ms of startup 4
Over-temperature protection threshold TTSD 150 165 170 °C 4
Output rise time Tr 400 ns 10% to 90% VCC 3
Output fall time Tf 40 ns 90% to 10% VCC 3
Input-to-output low-to-high propagation delay TPLH 900 ns 3
Input-to-output high-to-low propagation delay TPHL 900 ns 3
Dead time TDEAD 350 ns 3
High-side power MOSFET on-resistance RDS(ON)_H 0.3 Ω IO=1A, 25°C 3
Low-side power MOSFET on-resistance RDS(ON)_L 0.3 Ω IO=1A, 25°C 3
Current-limit detection blanking time TLIMIT_BLANK 2.5 us 4
Turn-off time after current-limit trip TLIMIT_OFF 25 us 4
Short-circuit protection threshold current IOCP 5 A 4
Short-circuit detection blanking time TOCP_LEB 2 us 4
Short-circuit restart time TOCP_RESET 2.5 ms 4
Over-temperature protection hysteresis THYS 40 °C 4
UVLO hysteresis VHYS 0.2 V VCCON - VCCOFF 3
Thermal resistance junction-to-case (SOP8-PP) θJC 15 °C/W SOP8-PP package 3

CAD (KiCad official)

  • Symbol: PN7706SPC-R1
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: pn7706spc-r1-etched.step / pn7706spc-r1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pn7706spc-r1.step / pn7706spc-r1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi Chipown Micro electronics datasheet (10 pp, sha256 346179ad78bd174d, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF