component
MOC217R2M
Public Made by Adomby adom
onsemi Transistor, Photovoltaic Output Optoisolators, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMOC217R2M
onsemi · Transistor, Photovoltaic Output Optoisolators · SOP-8
MOC217R2M from onsemi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ANODE | passive | Anode of the gallium arsenide infrared LED input; continuous forward current is rated 60 mA maximum and reverse voltage 6.0 V. |
| 2 | CATHODE | passive | Cathode of the infrared LED input; connect to the input return. |
| 3 | N/C | unconnected | No internal connection. |
| 4 | N/C | unconnected | No internal connection. |
| 5 | EMITTER | passive | Phototransistor emitter; emitter-collector voltage is rated 7 V maximum. |
| 6 | COLLECTOR | passive | Phototransistor collector; collector-emitter voltage is rated 30 V maximum and continuous collector current 150 mA. |
| 7 | BASE | passive | Phototransistor base, optional connection (a base-emitter resistor RBE can be used to adjust CTR and switching speed). |
| 8 | N/C | unconnected | No internal connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOP-8 |
| Category | Optoisolators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage Temperature | TSTG | -40 | 125 | °C | 4 | ||
| Ambient Operating Temperature | TA | -40 | 100 | °C | 4 | ||
| Junction Temperature | TJ | -40 | 125 | °C | 4 | ||
| Lead Solder Temperature | TSOL | 260 | °C | for 10 seconds | 4 | ||
| Total Device Power Dissipation | PD | 240 | mW | @ TA = 25°C | 4 | ||
| Continuous Forward Current (LED) | IF | 60 | mA | 4 | |||
| Forward Current - Peak (LED) | IF (pk) | 1 | A | PW = 100 µs, 120 pps | 4 | ||
| Reverse Voltage (LED) | VR | 6 | V | 4 | |||
| LED Power Dissipation | PD | 90 | mW | @ TA = 25°C | 4 | ||
| Continuous Collector Current | IC | 150 | mA | 4 | |||
| Collector-Emitter Voltage | VCEO | 30 | V | 4 | |||
| Emitter-Collector Voltage | VECO | 7 | V | 4 | |||
| Detector Power Dissipation | PD | 150 | mW | @ TA = 25°C | 4 | ||
| Input Forward Voltage (MOC216M, MOC217M) | VF | 1.07 | 1.3 | V | IF = 1 mA | 5 | |
| Reverse Leakage Current | IR | 0.001 | 100 | µA | VR = 6 V | 5 | |
| Collector-Emitter Dark Current | ICEO1 | 1 | 50 | nA | VCE = 10 V, TA = 25°C | 5 | |
| Collector-Emitter Breakdown Voltage (MOC211M, MOC212M, MOC213M, MOC216M, MOC217M) | BVCEO | 30 | 100 | V | IC = 100 µA | 5 | |
| Collector-Base Breakdown Voltage | BVCBO | 70 | 120 | V | IC = 10 µA | 5 | |
| Emitter-Collector Breakdown Voltage | BVECO | 7 | 10 | V | IE = 100 µA | 5 | |
| Collector-Output Current (CTR), MOC217M | CTR | 100 | % | IF = 1 mA, VCE = 5 V | 5 | ||
| Collector-Emitter Saturation Voltage (MOC216M, MOC217M) | VCE(SAT) | 0.4 | V | IC = 100 µA, IF = 1 mA | 5 | ||
| Input-Output Isolation Voltage | VISO | 2500 | VACRMS | t = 1 Minute | 6 | ||
| Maximum Working Insulation Voltage (DIN EN/IEC 60747-5-5) | VIORM | 565 | Vpeak | Safety limit, DIN EN/IEC 60747-5-5 | 3 | ||
| Highest Allowable Over-Voltage (DIN EN/IEC 60747-5-5) | VIOTM | 4000 | Vpeak | Safety limit, DIN EN/IEC 60747-5-5 | 3 | ||
| Case Temperature (safety limit) | TS | 150 | °C | Safety limit, DIN EN/IEC 60747-5-5 | 3 | ||
| Input Current (safety limit) | IS,INPUT | 200 | mA | Safety limit, DIN EN/IEC 60747-5-5 | 3 | ||
| Output Power (safety limit) | PS,OUTPUT | 300 | mW | Safety limit, DIN EN/IEC 60747-5-5 | 3 |
CAD (KiCad official)
- Symbol:
MOC217R2M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
moc217r2m-etched.step/moc217r2m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);moc217r2m.step/moc217r2m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (12 pp, sha256
29d61420022da0d3, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).