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Contents

README

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SP3022-01ETG-MS

MSKSEMI · ESD Protection Devices · SOD-882

SP3022-01ETG-MS from MSKSEMI, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOD-882
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse working peak voltage VRWM 5 V 3
Maximum reverse leakage current IR 0.5 µA @ VRWM 3
Breakdown voltage VBR 6 V @ IT (Note 2), IT = 1.0 mA, pulse test at 25℃ 3
Clamping voltage VC 12 V @ IPP = 1 A (Note 3) 3
Clamping voltage VC 20 V @ MAX IPP (Note 3) 3
Maximum reverse peak pulse current IPP 4 A Surge current waveform per Figure 1 (Note 3) 3
Peak power dissipation PPK 80 W Surge current waveform per Figure 1 (Note 3) 3
Capacitance C 0.25 0.3 pF @ VR = 0 and f = 1.0 MHz 3
ESD voltage, IEC 61000-4-2 air discharge -30 30 kV IEC 61000-4-2 (ESD) Air discharge 3
ESD voltage, IEC 61000-4-2 contact discharge -30 30 kV IEC 61000-4-2 (ESD) Contact discharge 3
ESD voltage per human body model 16 kV Human Body Model 3
Total power dissipation PD 200 mW Total Power Dissipation on FR-5 Board (Note 1) @ TA=25℃ 3
Junction and storage temperature range TJ,TSTG -55 150 ℃ Junction and Storage Temperature Range 3
Lead solder temperature (maximum) TL 260 ℃ 10 second duration 3

CAD (KiCad official)

  • Symbol: SP3022-01ETG-MS
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: SOD-882 (KiCad packages3D, STEP)
  • 3D model files: sp3022-01etg-ms-etched.step / sp3022-01etg-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3022-01etg-ms.step / sp3022-01etg-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (5 pp, sha256 7d274bb72e751783, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF