component
SP3022-01ETG-MS
Public Made by Adomby adom
MSKSEMI ESD Protection Devices, SOD-882. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSP3022-01ETG-MS
MSKSEMI · ESD Protection Devices · SOD-882
SP3022-01ETG-MS from MSKSEMI, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOD-882 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse working peak voltage | VRWM | 5 | V | 3 | |||
| Maximum reverse leakage current | IR | 0.5 | µA | @ VRWM | 3 | ||
| Breakdown voltage | VBR | 6 | V | @ IT (Note 2), IT = 1.0 mA, pulse test at 25℃ | 3 | ||
| Clamping voltage | VC | 12 | V | @ IPP = 1 A (Note 3) | 3 | ||
| Clamping voltage | VC | 20 | V | @ MAX IPP (Note 3) | 3 | ||
| Maximum reverse peak pulse current | IPP | 4 | A | Surge current waveform per Figure 1 (Note 3) | 3 | ||
| Peak power dissipation | PPK | 80 | W | Surge current waveform per Figure 1 (Note 3) | 3 | ||
| Capacitance | C | 0.25 | 0.3 | pF | @ VR = 0 and f = 1.0 MHz | 3 | |
| ESD voltage, IEC 61000-4-2 air discharge | -30 | 30 | kV | IEC 61000-4-2 (ESD) Air discharge | 3 | ||
| ESD voltage, IEC 61000-4-2 contact discharge | -30 | 30 | kV | IEC 61000-4-2 (ESD) Contact discharge | 3 | ||
| ESD voltage per human body model | 16 | kV | Human Body Model | 3 | |||
| Total power dissipation | PD | 200 | mW | Total Power Dissipation on FR-5 Board (Note 1) @ TA=25℃ | 3 | ||
| Junction and storage temperature range | TJ,TSTG | -55 | 150 | ℃ | Junction and Storage Temperature Range | 3 | |
| Lead solder temperature (maximum) | TL | 260 | ℃ | 10 second duration | 3 |
CAD (KiCad official)
- Symbol:
SP3022-01ETG-MS - Footprint:
Diode_SMD:D_SOD-882 - 3D model: SOD-882 (KiCad packages3D, STEP)
- 3D model files:
sp3022-01etg-ms-etched.step/sp3022-01etg-ms-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp3022-01etg-ms.step/sp3022-01etg-ms.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (5 pp, sha256
7d274bb72e751783, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).