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Contents

README

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HX1485-S

ZHHXDZ · RS-485 / RS-422 ICs · SOP-8

HX1485-S from ZHHXDZ, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver data output: driven low when A-B is at -200 mV, and high at -50 mV, with an open-circuit or short-circuit receiver input (fail-safe).
2 RE input Receiver enable input: the receiver output is active when RE is low and goes to high impedance when RE is high.
3 DE input Driver enable input: the chip is in the transmit state when DE is high, and the driver outputs A and B are high impedance when DE is low.
4 DI input Driver data input: with DE high, DI high drives A high and B low, and DI low drives A low and B high.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting driver differential output and receiver differential input; tri-state when the driver is disabled, with ±15 kV HBM ESD protection between A and B.
7 B bidirectional Inverting driver differential output and receiver differential input; tri-state when the driver is disabled, with ±15 kV HBM ESD protection between A and B.
8 VCC power_in Power supply, specified at 5 V ±5% (working voltage range 4.5 V to 5.5 V).

Key specifications

Parameter Value
Manufacturer ZHHXDZ
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage range Vcc 4.5 5.5 V 2
Supply voltage VCC 6 V 2
Control input voltage DE,RE 6 V 2
Drive input voltage DI 6 V 2
Drive output voltage / receive input voltage A,B -7 12 V 2
Storage temperature range TSTG -55 150 ℃ 2
Operating temperature range TOP -40 85 ℃ 2
Maximum operating temperature range TMOP -55 125 ℃ 2
Power dissipation PD 470 mW SOP-8 (+70℃ or above) 2
Solder temperature TL 300 ℃ Solder temperature (10 seconds) 2
Driver differential output (with load) VOD2 1.5 V R=54Ω or R=27Ω, Figure 1 2
Change in driver differential output when DI changes ∆VOD 0.2 V 2
Driver common mode output voltage VOC 1 3 V 2
Change in driver common mode output voltage when DI changes ∆VOC 0.2 V 2
Input high voltage (DE, RE, DI) VIH 2 V 2
Input low voltage (DE, RE, DI) VIL 0.8 V 2
Input current (DE, RE, DI) IIN1 -2 2 uA 2
Input current (A, B) IIN2 40 90 uA DE=0V, Vcc=5V, VIN=5V 2
Input current (A, B) IIN2 60 100 uA DE=0V, Vcc=5V, VIN=0V 2
Receiver differential input threshold voltage VTH -200 -50 mV -7V ≤VCM≤+12V 2
Receiver differential input threshold voltage change ∆VTH 25 mV 2
Receiver output high level VOH 4 V IO=-8mA 2
Receiver output low level VOL 0.4 V IO=8mA 2
Receiver output leakage current (tri-state) IOZR 1 uA 0.4V ≤Vo≤2.4V 2
Receiver input impedance RIN 96 kΩ 2
No load operating current ICC 480 600 uA -7V ≤VCM≤+12V, RE=DI=GND or DE = Vcc 2
No load operating current (DE=GND) ICC 450 600 uA DE=GND 2
Receiver output short-circuit current IOSR 95 mA 0V ≤VRO≤ 2
Driver output short-circuit current IOD 100 mA Short circuit current between A/B 2
Driver input to output, low to high tDPLH 250 1000 nS RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 2
Driver input to output, high to low tDPHL 250 1000 nS RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 2
Driver output offset /tDPLH, tDPHL/ tDSKEW -100 100 nS 2
Driver enables high output tDZH 2500 nS CL=100pF, Figure 4,6, S2 closed 2
Driver enables output to be low tDZL 2500 nS CL=100pF, Figure 4,6, S1 closed 2
Drive from low to off tDLZ 100 nS CL=15pF, Figure 4,6, S1 closed 2
Drive from high to off tDHZ 100 nS CL=15pF, Figure 4,6, S2 closed 2
Receiver input to output, low to high tRPLH 200 nS /VID/ ≥2.0V; VID rising and falling time ≤15nS, Figure 7,9 2
Receiver input to output, high to low tRPHL 200 nS /VID/ ≥2.0V; VID rising and falling time ≤15nS, Figure 7,9 2
Differential receiver offset tRSKEW -30 30 nS 2
Receiver enables output to be low tRZL 20 50 nS S1 closed, CL=100pF, Figure 2,8 2
Receiver enable to output high tRZH 20 50 nS S2 closed, CL=100pF, Figure 2,8 2
Receiver from low to off tRLZ 20 50 nS S1 closed, CL=100pF, Figure 2,8 2
Receiver from high to off tRHZ 20 50 nS S2 closed, CL=100pF, Figure 2,8 2

CAD (KiCad official)

  • Symbol: HX1485-S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx1485-s-etched.step / hx1485-s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx1485-s.step / hx1485-s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ZHHXDZ datasheet (4 pp, sha256 55d584b89ded8ffd, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF