component

RJM32F103CBT6Y

Public Made by Adom

by adom

Runjet(瑞纳捷) Microcontrollers (MCU/MPU/SOC), LQFP-48(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentembedded processors & controllersrjm32f103cbt6yfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity

3D Model

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Datasheet

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

RJM32F103CBT6Y

Runjet(瑞纳捷) · Microcontrollers (MCU/MPU/SOC) · LQFP-48(7x7)

RJM32F103CBT6Y from Runjet(瑞纳捷), in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup-domain supply, 1.8 to 3.6V, powers the RTC and backup registers when VDD is absent.
2 PC13 bidirectional General-purpose I/O PC13, also TAMPER/RTC function as printed in the pin table.
3 PC14 bidirectional General-purpose I/O PC14, with OSC32_IN listed as its function in the pin table.
4 PC15 bidirectional General-purpose I/O PC15, with OSC32_OUT listed as its function in the pin table.
5 PD0 bidirectional Port D I/O PD0 used as OSC_IN, the input for the 4 to 16MHz crystal oscillator (HSE, typical 8MHz).
6 PD1 bidirectional Port D I/O PD1 used as OSC_OUT, the output of the 4 to 16MHz crystal oscillator (HSE).
7 NRST bidirectional Hardware reset pin; an external reset on NRST resets the chip.
8 VSSA power_in Analog ground pin for the analog section.
9 VDDDA power_in Analog supply pin (printed as VDDDA); VDDA must be 2.4 to 3.6V when the ADC is used and should be powered from the same supply as VDD, with at most 300mV difference.
10 PA0 bidirectional GPIO PA0 with WKUP wake-up input (rising edge exits standby) and ADC_IN0 analog input.
11 PA1 bidirectional GPIO PA1 with TIM2_CH2, UART2_RTS and ADC_IN1 functions.
12 PA2 bidirectional GPIO PA2 with TIM2_CH3, UART2_TX and ADC_IN2 functions.
13 PA3 bidirectional GPIO PA3 with TIM2_CH4, UART2_RX and ADC_IN3 functions.
14 PA4 bidirectional GPIO PA4 with QSPI_NSS0, SPIS1_NSS, UART2_CK and ADC_IN4 functions.
15 PA5 bidirectional GPIO PA5 with QSPI_SCK, SPIS1_SCK and ADC_IN5 functions.
16 PA6 bidirectional GPIO PA6 with TIM1_BKIN, TIM3_CH1, QSPI_MI_IO1, SPIS1_SO and ADC_IN6 functions.
17 PA7 bidirectional GPIO PA7 with TIM1_CH1N, TIM3_CH2, QSPI_MO_IO0, SPIS1_SI and ADC_IN7 functions.
18 PB0 bidirectional GPIO PB0 with TIM1_CH2N, TIM3_CH3, I2S_MCLK, QSPI_IO2 and ADC_IN8 functions.
19 PB1 bidirectional GPIO PB1 with TIM1_CH3N, TIM3_CH4, QSPI_IO3 and ADC_IN9 functions.
20 PB2 bidirectional GPIO PB2 that is also the BOOT1 boot-mode pin, used with BOOT0 to select the boot source.
21 PB10 bidirectional GPIO PB10 with TIM2_CH3, TIM4_CH1, I2C2_SCL, QSPI_NSS2 and UART3_TX functions.
22 PB11 bidirectional GPIO PB11 with TIM2_CH4, I2C2_SDA, SPIM2_NSS1 and UART3_RX functions.
23 VSS_1 power_in Ground pin for the digital supply domain.
24 VDD_1 power_in Main supply pin for I/O and the internal regulator, 2.0 to 3.6V.
25 PB12 bidirectional GPIO PB12 with TIM1_BKIN, I2S_WS, LED4, SPIM2_NSS0, SPIS2_NSS and UART3_CK functions.
26 PB13 bidirectional GPIO PB13 with TIM1_CH1N, I2S_SCLK, LED5, SPIM2_SCK, SPIS2_SCK and UART3_CTS functions.
27 PB14 bidirectional GPIO PB14 with TIM1_CH2N, LED6, SPIM2_MI, SPIS2_SO and UART3_RTS functions.
28 PB15 bidirectional GPIO PB15 with TIM1_CH3N, LED7, SPIM2_MO, SPIS2_SI and I2S_SD0 functions.
29 PA8 bidirectional GPIO PA8 with TIM1_CH1, LED0, UART1_CK, MCO and CMPA_P0 functions.
30 PA9 bidirectional GPIO PA9 with TIM1_CH2, LED1, UART1_TX and CMPA_N0 functions.
31 PA10 bidirectional GPIO PA10 with TIM1_CH3, LED2 and UART1_RX functions.
32 PA11 bidirectional GPIO PA11 with TIM1_CH4, LED3, UART1_CTS and USBDM functions.
33 PA12 bidirectional GPIO PA12 with TIM1_ETR, UART1_RTS and USBDP functions.
34 PA13 bidirectional GPIO PA13 with SWDIO, QSPI_NSS1 and CMPA_P3 functions.
35 VSS_2 power_in Ground pin for the digital supply domain.
36 VDD_2 power_in Supply pin for I/O and the internal regulator, 2.0 to 3.6V.
37 PA14 bidirectional GPIO PA14 with SWDCLK, QSPI_NSS2 and CMPA_N3 functions.
38 PA15 bidirectional GPIO PA15 with TIM2_CH1_ETR, I2S_WS, I2C1_SMBAI, QSPI_NSS0, SPIS1_NSS and CMPB_P3 functions.
39 PB3 bidirectional GPIO PB3 with SWO, TIM2_CH2, I2S_SCLK, QSPI_SCK, SPIS1_SCK and CMPB_N3 functions.
40 PB4 bidirectional GPIO PB4 with TIM3_CH1, QSPI_MI_IO1, SPIS1_SO and CMPA_P1 functions.
41 PB5 bidirectional GPIO PB5 with TIM3_CH2, I2S_SD1, I2C1_SMBAI, QSPI_MO_IO0, SPIS1_SI and CMPA_P2 functions.
42 PB6 bidirectional GPIO PB6 with TIM4_CH1, I2C1_SCL, QSPI_NSS1, UART1_TX and CMPA_N1 functions.
43 PB7 bidirectional GPIO PB7 with TIM4_CH2, I2C1_SDA, SPIM2_NSS1, UART1_RX and CMPA_N2 functions.
44 BOOT0 input Boot-mode select input that, together with BOOT1, chooses boot from user Flash, system memory or embedded SRAM.
45 PB8 bidirectional GPIO PB8 with TIM4_CH3, I2C1_SCL, SPIM2_NSS2, UART1_CTS and CMPB_N1 functions.
46 PB9 bidirectional GPIO PB9 with TIM4_CH4, I2C1_SDA, UART1_RTS and CMPB_N2 functions.
47 VSS_3 power_in Ground pin for the digital supply domain.
48 VDD_3 power_in Supply pin for I/O and the internal regulator, 2.0 to 3.6V.

Key specifications

Parameter Value
Manufacturer Runjet(瑞纳捷)
Package LQFP-48(7x7)
Category Embedded Processors & Controllers
Pins 48

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External main supply voltage (VDD and VDDA) VDD, VSS -0.5 3.6 V 25
Total current through VDD/VDDA supply lines IVDD 60 mA 25
Total current through VSS ground lines IVSS 60 mA 25
Output sink current on any I/O and control pin IIO 16 mA 25
Output source current on any I/O and control pin IIO -16 mA 25
Injection current on any pin IINJ(PIN) -5 5 mA 25
Total injection current ΣIINJ(PIN) -25 25 mA 25
Storage temperature range TSTG -45 150 ℃ 26
Maximum junction temperature TJ 100 ℃ 26
Internal AHB clock frequency fHCLK 72 MHz 26
Internal APB1 clock frequency fPCLK1 72 MHz 26
Internal APB2 clock frequency fPCLK2 72 MHz 26
Standard operating voltage VDD 2 3.6 V 26
Analog operating voltage (ADC not used) VDDA 2 3.6 V 未使用 ADC 26
Backup-domain operating voltage VBAT 1.8 3.6 V 26
Ambient temperature T -40 85 ℃ 26
ADC analog supply voltage VDDA 2.4 3.6 V 33
ADC sampling rate fS 0.05 1 MHz 33
ADC external trigger frequency fTRIG 823 KHz fADC= 14MHz 33
ADC conversion voltage range VAIN 0 V 33
ADC external input impedance RAIN 200 Ω 33
ADC analog input junction leakage current Ilkg 10 uA 34
ADC sampling rate (12-bit) FCONV 940 KSPS 12bit 34
Comparator input voltage range Vin 0.6 V 33
Comparator hysteresis VHYST 2 5 mV 33
Comparator input offset voltage VOFF 5 15 mV 33
Comparator propagation delay TPGD 200 nS 33
Comparator operating current Iq 8.5 uA 33
USB operating voltage VDD 3 3.6 V 32
Differential input sensitivity VDI 0.2 V (USBDP, USBDM) 32
Differential common-mode range VCM 0.8 2.5 V Includes VDI range 32
Single-ended receiver threshold VSE 1.3 2 V 32
Static output low level VOL 0.3 V RL of1.5kom to3.6V 32
Static output high level VOH 2.8 3.6 V RL of15kom toVSSV 32
USB full-speed rise time tr 4 20 ns CL= 50 pF 33
USB full-speed fall time tf 4 20 ns CL= 50 pF 33
USB rise/fall time matching (tr/tf) trfm 90 110 % 33
Timer resolution time Tres (TIM) 1 TTIMxCLK 32
Timer resolution RESTIM 20 bit 32
16-bit counter clock period (internal clock selected) Tcounter 1 65536 TTIMxCLK 选择内部时钟时 32
Timer external clock frequency on CH1 to CH4 FEXT 0 MHz CH1 至 CH4 32
Input low-level voltage VIL -0.5 V 31
I/O input leakage current Ilkg -1 1 uA VSS ≤ Vin ≤ VDD 31
Weak pull-up equivalent resistance Rpu 30 40 50 kΩ Vin=VSS 31
Weak pull-down equivalent resistance Rpd 30 40 50 kΩ Vin=VDD 31
Maximum output frequency, speed x0 fmax(IO)out 10 MHz CL=50pF，VDD=2V to 3.6V 32
Maximum output frequency, speed x1 fmax(IO)out 50 MHz CL=50pF，VDD=2V to 3.6V 32
Page program current IDDPROG 2 mA 30
Page erase current IDD ERASE 1.5 mA 30
Read mode current IDD READ 4.7 mA @48MHz 30
Read mode current IDD READ 2.5 mA @24MHz 30
Endurance (program/erase cycles) NEND 100 kcycles 30
Data retention period tRET 10 year 30
User external clock source frequency (HSE) fHSEext 8 16 MHz 28
HSE clock duty cycle DuCy(HSE) 45 55 % 28
MHSI clock startup time TSU(MHSI) 1 2 us VSS ≤ Vin ≤ VDD 29
FHSI clock startup time TSU (FHSI) 200 500 ns VSS ≤ Vin ≤ VDD 29
LSI frequency fLSI 20 40 KHz 29
PLL input clock frequency fPLLIN 1 8 16 MHz 29
PLL input clock duty cycle 40 60 % 29

CAD (KiCad official)

  • Symbol: RJM32F103CBT6Y
  • Footprint: Package_QFP:LQFP-48_7x7mm_P0.5mm
  • 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: rjm32f103cbt6y-etched.step / rjm32f103cbt6y-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rjm32f103cbt6y.step / rjm32f103cbt6y.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Runjet(瑞纳捷) datasheet (41 pp, sha256 f545b5d24ed62228, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF