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NCP170BMX330TCG

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onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management icsncp170bmx330tcgfactory-2.0.0extractor-text

Verified NCP170BMX330TCG

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 5 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: NCP170BMX330TCG · XDFN-4-EP(1x1) · 5 pins
  • ✓copper: 5 copper pads, none touching another net
  • ✓datasheet: all 5 pin names found in the 28-page datasheet
  • ✓distributor: lcsc C892250, digikey NCP170BMX330TCGOSTR-ND, mouser 863-NCP170BMX330TCG
  • ✓family: OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-4owkushl/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 5 pins = 5 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 5 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ ncp170bmx330tcg.kicad_sym✓ ncp170bmx330tcg.kicad_mod✓ ncp170bmx330tcg.step
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3D Model

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Symbol & Footprint

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Contents

README

markdown

NCP170BMX330TCG

onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

NCP170BMX330TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output pin; the datasheet limits VOUT to −0.3 V to VIN + 0.3 V and specifies IOUT of at least 150 mA.
2 GND power_in Power supply ground pin for the regulator.
3 EN input Chip enable input (active high) with VENH minimum 1.2 V and VENL maximum 0.4 V; the chip enable input is rated −0.3 V to 6.0 V.
4 IN power_in Power supply input; operating input voltage range is 2.2 V to 5.5 V and the absolute maximum input voltage is 6.0 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 10
Output Voltage VOUT 3.267 3.3 3.333 V TA = +25°C 10
Output Voltage VOUT 3.234 3.3 3.366 V −40°C ≤ TJ ≤ 85°C 10
Line Regulation LineReg 0.05 0.2 %/V 4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA 10
Load Regulation LoadReg -20 1 20 mV 0 mA < IOUT ≤ 150 mA, VIN = 4.3 V 10
Dropout Voltage VDO 180 250 mV IOUT = 150 mA 10
Output Current IOUT 150 mA 10
Quiescent Current IQ 0.5 0.9 A IOUT = 0 mA 10
Standby Current ISTB 0.1 0.5 A VEN = 0 V, TJ = 25°C 10
EN Pin Threshold Voltage High VENH 1.2 V EN Input Voltage “H” 10
EN Pin Threshold Voltage Low VENL 0.4 V EN Input Voltage “L” 10
Input Voltage (Note 1) VIN 6 V 2
Output Voltage VOUT -0.3 V Upper limit printed as VIN + 0.3 V 2
Chip Enable Input VCE -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V AEC-Q100-002 (EIA/JESD22-A114) 2
ESD Capability, Machine Model ESDMM 200 V AEC-Q100-003 (EIA/JESD22-A115) 2
Operating Junction Temperature Range TJ -40 85 °C Performance guaranteed over the indicated operating temperature range 10
Junction Temperature for Reliable Operation TJ 125 °C For reliable operation 21
Thermal Resistance, Junction-to-Air RJA 250 °C/W XDFN4 1 × 1 mm 2

CAD (KiCad official)

  • Symbol: NCP170BMX330TCG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp170bmx330tcg-etched.step / ncp170bmx330tcg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp170bmx330tcg.step / ncp170bmx330tcg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (28 pp, sha256 e9ce3964b316d909, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF