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Contents

README

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DMP610DL-7

Diodes Incorporated · MOSFETs · SOT-23

DMP610DL-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage rating is ±30 V with a threshold of -0.8 V to -2.0 V at ID = -1 mA.
2 S passive Source of the P-channel MOSFET; body diode continuous forward current is -0.5 A.
3 D passive Drain; drain-source voltage rating is -60 V with continuous drain current of -180 mA at TA = +25°C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -60 V VGS = 0V, ID = -250µA 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -60V, VGS = 0V 2
Gate-Source Leakage IGSS 100 nA VGS = 20V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) -0.8 -2 V VDS = VGS, ID = -1mA 2
Static Drain-Source On-Resistance RDS(ON) 10 Ω VGS = -5V, ID = -0.1A 2
Drain-Source Voltage VDSS -60 V 2
Gate-Source Voltage VGSS -30 30 V 2
Continuous Drain Current, steady state, TA = +25°C ID -180 mA VGS = -5V, steady state, TA = +25°C (Note 6) 2
Continuous Drain Current, steady state, TA = +70°C ID -130 mA VGS = -5V, steady state, TA = +70°C (Note 6) 2
Maximum Continuous Body Diode Forward Current IS -0.5 A Note 6 2
Pulsed Drain Current IDM -1.2 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation PD 310 mW Note 5, device on FR-4 PCB with minimum recommended pad layout, TA = +25°C 2
Total Power Dissipation PD 500 mW Note 6, device on 1 in x 1 in FR-4 PCB with high coverage 2oz copper, TA = +25°C 2
Thermal Resistance, Junction to Ambient, steady state RθJA 405 °C/W Note 5, minimum recommended pad layout FR-4 PCB 2
Thermal Resistance, Junction to Ambient, steady state RθJA 251 °C/W Note 6, 1 in x 1 in FR-4 PCB with high coverage 2oz copper 2
Thermal Resistance, Junction to Ambient (Figure 12 transient curve basis) RθJA 426 °C/W Printed as the RθJA used for the Figure 12 transient thermal curve 5
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: DMP610DL-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: dmp610dl-7-etched.step / dmp610dl-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmp610dl-7.step / dmp610dl-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 6bcf4a888d257b89, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF