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Contents

README

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1.5SMBJ30A

BOURNS · ESD And Surge Protection (TVS/ESD) · SMB(DO-214AA)

1.5SMBJ30A from BOURNS, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer BOURNS
Package SMB(DO-214AA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage (unidirectional 1.5SMBJ30A) VBR 33.3 36.8 V @ IT = 1 mA 2
Maximum reverse leakage IR 1 µA @ VRWM = 30.0 V 2
Maximum clamping voltage (10/1000 µs) VC 48.4 V 10/1000 µs waveform, @ IPP = 31.0 A 2
Maximum peak pulse current (10/1000 µs) IPP 31 A 10/1000 µs waveform 2
Maximum clamping voltage (8/20 µs) VC 62.9 V 8/20 µs waveform, @ IPP = 155.0 A 2
Maximum peak pulse current (8/20 µs) IPP 155 A 8/20 µs waveform 2
Minimum peak pulse power dissipation PPK 1500 Watts TP = 1 ms (Note 1,2) 1
Peak forward surge current IFSM 100 Amps 8.3 ms single half sine wave superimposed on rated load (JEDEC method), unidirectional only (Note 3) 1
Operating temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1
Working peak reverse voltage (standoff) VRWM 30 V Unidirectional 1.5SMBJ30A 2
Device voltage tolerance (suffix A) -5 5 % Suffix A = 5 % tolerance unidirectional device 2
Typical temperature coefficient of breakdown voltage DVBR 0.1 % x VBR @ 25 °C x ΔT Typical, series feature statement 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 2. 8 mm x 8 mm copper pad on each terminal. 1

CAD (KiCad official)

  • Symbol: 1.5SMBJ30A
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: 1-5smbj30a-etched.step / 1-5smbj30a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1-5smbj30a.step / 1-5smbj30a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOURNS datasheet (6 pp, sha256 9ea13bf98c605aa7, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF