component
UCC27425DGNR
Public Unreviewedby Ray
Texas Instruments Gate Drivers, MSOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
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markdownUCC27425DGNR
Texas Instruments · Gate Drivers · MSOP-8
UCC27425DGNR from Texas Instruments, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ENBA | input | Enable input for channel A. Active-high logic; OUTA is held low when ENBA is low or left floating (internal pull-down). TTL/CMOS compatible thresholds referenced to GND. |
| 2 | INA | input | Non-inverting logic input for channel A. TTL/CMOS compatible with hysteresis; drives OUTA in phase. Referenced to GND. |
| 3 | GND | power_in | Device ground return. Common reference for logic inputs, enables, VDD bypass, and gate-drive output return currents. Tie to the thermal PowerPAD for optimal thermal performance. |
| 4 | INB | input | Non-inverting logic input for channel B. TTL/CMOS compatible with hysteresis; drives OUTB in phase. Referenced to GND. |
| 5 | ENBB | input | Enable input for channel B. Active-high logic; OUTB is held low when ENBB is low or left floating (internal pull-down). TTL/CMOS compatible thresholds referenced to GND. |
| 6 | OUTB | output | Gate-drive output for channel B. 4-A peak source/sink current, rail-to-rail swing between GND and VDD, capable of driving high-capacitance MOSFET gates. Place bypass capacitance close to VDD/GND. |
| 7 | VDD | power_in | Bias supply input, 4 V to 15 V recommended (18 V absolute max). Bypass locally with a low-ESR ceramic capacitor (typically 1 uF or larger in parallel with a bulk capacitor) referenced to GND to supply peak gate-drive currents. |
| 8 | OUTA | output | Gate-drive output for channel A. 4-A peak source/sink current, rail-to-rail swing between GND and VDD, capable of driving high-capacitance MOSFET gates. Place bypass capacitance close to VDD/GND. |
| 9 | PowerPAD | power_in | Exposed thermal pad on the underside of the DGN package. Must be soldered to the PCB ground plane for proper thermal dissipation; electrically connected to GND (pin 3). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8 |
| Category | Motor Driver ICs |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
UCC27425DGNRUCC27425DGNRDGNTUCC27425DGNRDUCC27425DGNRDR
CAD (KiCad official)
- Symbol:
UCC27425DGNR - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (None pp, sha256
5461b91e0c21c003, retrieved 2026-08-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).