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LTC2320IUKG-14#PBF
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Analog Devices Analog To Digital Converters (ADCs), QFN-52-EP(7x8). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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Datasheet
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README
markdownLTC2320IUKG-14#PBF
Analog Devices · Analog To Digital Converters (ADCs) · QFN-52-EP(7x8)
LTC2320IUKG-14#PBF from Analog Devices, in a QFN-52-EP(7x8). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AIN6- | input | Analog differential input pin for channel 6; full-scale range (AIN6+ - AIN6-) is ±REFOUT3 voltage; can be driven from VDD to GND. |
| 2 | AIN6+ | input | Analog differential input pin for channel 6; full-scale range (AIN6+ - AIN6-) is ±REFOUT3 voltage; can be driven from VDD to GND. |
| 3 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 4 | AIN5- | input | Analog differential input pin for channel 5; full-scale range (AIN5+ - AIN5-) is ±REFOUT3 voltage; can be driven from VDD to GND. |
| 5 | AIN5+ | input | Analog differential input pin for channel 5; full-scale range (AIN5+ - AIN5-) is ±REFOUT3 voltage; can be driven from VDD to GND. |
| 6 | REFOUT3 | output | Reference buffer 3 output; nominally outputs 4.096V; decouple with 10µF ceramic capacitor to GND; can be overdriven with external reference 1.25V to 5V if REFBUFEN grounded. |
| 7 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 8 | REF | output | Common 4.096V reference output; decouple to GND with 1µF low ESR ceramic capacitor; may be overdriven with single external reference for ADC cores 1-4. |
| 9 | REFOUT2 | output | Reference buffer 2 output; nominally outputs 4.096V; decouple with 10µF ceramic capacitor to GND; can be overdriven with external reference 1.25V to 5V if REFBUFEN grounded. |
| 10 | AIN4- | input | Analog differential input pin for channel 4; full-scale range (AIN4+ - AIN4-) is ±REFOUT2 voltage; can be driven from VDD to GND. |
| 11 | AIN4+ | input | Analog differential input pin for channel 4; full-scale range (AIN4+ - AIN4-) is ±REFOUT2 voltage; can be driven from VDD to GND. |
| 12 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 13 | AIN3- | input | Analog differential input pin for channel 3; full-scale range (AIN3+ - AIN3-) is ±REFOUT2 voltage; can be driven from VDD to GND. |
| 14 | AIN3+ | input | Analog differential input pin for channel 3; full-scale range (AIN3+ - AIN3-) is ±REFOUT2 voltage; can be driven from VDD to GND. |
| 15 | VDD | power_in | Power supply (3.3V or 5V); bypass to GND with 10µF and 0.1µF ceramic capacitors close to the part; VDD pins must be shorted together and driven from same supply. |
| 16 | AIN2- | input | Analog differential input pin for channel 2; full-scale range (AIN2+ - AIN2-) is ±REFOUT1 voltage; can be driven from VDD to GND. |
| 17 | AIN2+ | input | Analog differential input pin for channel 2; full-scale range (AIN2+ - AIN2-) is ±REFOUT1 voltage; can be driven from VDD to GND. |
| 18 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 19 | AIN1- | input | Analog differential input pin for channel 1; full-scale range (AIN1+ - AIN1-) is ±REFOUT1 voltage; can be driven from VDD to GND. |
| 20 | AIN1+ | input | Analog differential input pin for channel 1; full-scale range (AIN1+ - AIN1-) is ±REFOUT1 voltage; can be driven from VDD to GND. |
| 21 | VDD | power_in | Power supply (3.3V or 5V); bypass to GND with 10µF and 0.1µF ceramic capacitors close to the part; VDD pins must be shorted together and driven from same supply. |
| 22 | REFOUT1 | output | Reference buffer 1 output; nominally outputs 4.096V; decouple with 10µF ceramic capacitor to GND; can be overdriven with external reference 1.25V to 5V if REFBUFEN grounded. |
| 23 | SDR/DDR | input | Double data rate input; controls frequency of SCK and CLKOUT; tie to GND for SDR mode or to OVDD for DDR mode; CLKOUT is delayed version of SCK for both states. |
| 24 | CNV | input | Convert input; when high defines acquisition phase; when low initiates conversion and output data readout; must be driven at OVDD levels with low jitter pulse. |
| 25 | CMOS/LVDS | input | I/O mode select; ground for CMOS mode, tie to OVDD for LVDS mode, float for low power LVDS mode. |
| 26 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 27 | SDO1 | output | CMOS serial data output for ADC channel 1; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 28 | SDO2 | output | CMOS serial data output for ADC channel 2; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 29 | SDO3 | output | CMOS serial data output for ADC channel 3; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 30 | SDO4 | output | CMOS serial data output for ADC channel 4; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 31 | OVDD | power_in | I/O interface digital power supply (1.71V to 2.63V range); nominally 1.8V or 2.5V for CMOS, 2.5V for LVDS; bypass to GND with 0.1µF capacitor. |
| 32 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 33 | CLKOUT | output | Serial data clock output; provides skew-matched clock to latch SDO output at receiver; echoes SCK input with small delay; logic level determined by OVDD. |
| 34 | CLKOUTEN | input | CLKOUT enable control; tie to OVDD to disable CLKOUT for small power savings; ground this pin if CLKOUT is used. |
| 35 | SDO5 | output | CMOS serial data output for ADC channel 5; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 36 | SDO6 | output | CMOS serial data output for ADC channel 6; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 37 | OVDD | power_in | I/O interface digital power supply (1.71V to 2.63V range); nominally 1.8V or 2.5V for CMOS, 2.5V for LVDS; bypass to GND with 0.1µF capacitor. |
| 38 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 39 | SDO7 | output | CMOS serial data output for ADC channel 7; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 40 | SDO8 | output | CMOS serial data output for ADC channel 8; conversion result shifted MSB first on falling edge of SCK in SDR mode or each SCK edge in DDR mode; 16 SCK edges required for 14-bit data. |
| 41 | SCK | input | Serial data clock input; falling edge shifts conversion result MSB first in SDR mode; each edge in DDR mode; logic level determined by OVDD; 100MHz for SDR or 50MHz for DDR at 1.5Msps. |
| 42 | DNC | unconnected | Do not connect this pin in CMOS mode. |
| 43 | REFBUFEN | input | Reference buffer output enable; tie to VDD when using internal reference; tie to ground to disable internal REFOUT1-4 buffers for external references; has 500kΩ internal pull-up to VDD. |
| 44 | VDD | power_in | Power supply (3.3V or 5V); bypass to GND with 10µF and 0.1µF ceramic capacitors close to the part; VDD pins must be shorted together and driven from same supply. |
| 45 | REFOUT4 | output | Reference buffer 4 output; nominally outputs 4.096V; decouple with 10µF ceramic capacitor to GND; can be overdriven with external reference 1.25V to 5V if REFBUFEN grounded. |
| 46 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 47 | AIN8- | input | Analog differential input pin for channel 8; full-scale range (AIN8+ - AIN8-) is ±REFOUT4 voltage; can be driven from VDD to GND. |
| 48 | AIN8+ | input | Analog differential input pin for channel 8; full-scale range (AIN8+ - AIN8-) is ±REFOUT4 voltage; can be driven from VDD to GND. |
| 49 | GND | power_in | Ground; must be tied directly to a solid ground plane. |
| 50 | AIN7- | input | Analog differential input pin for channel 7; full-scale range (AIN7+ - AIN7-) is ±REFOUT4 voltage; can be driven from VDD to GND. |
| 51 | AIN7+ | input | Analog differential input pin for channel 7; full-scale range (AIN7+ - AIN7-) is ±REFOUT4 voltage; can be driven from VDD to GND. |
| 52 | VDD | power_in | Power supply (3.3V or 5V); bypass to GND with 10µF and 0.1µF ceramic capacitors close to the part; VDD pins must be shorted together and driven from same supply. |
| 53 | GND | power_in | Exposed pad ground; must be soldered to PCB ground plane. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | QFN-52-EP(7x8) |
| Category | ADC/DAC/Data Conversion |
| Pins | 53 |
CAD (KiCad official)
- Symbol:
LTC2320IUKG-14#PBF - Footprint:
Package_DFN_QFN:QFN-52-1EP_7x8mm_P0.5mm_EP5.41x6.45mm - 3D model: QFN-52-EP(7x8) (KiCad packages3D, STEP)
- 3D model files:
ltc2320iukg-14-pbf-etched.step/ltc2320iukg-14-pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ltc2320iukg-14-pbf.step/ltc2320iukg-14-pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (34 pp, sha256
321752c03d0fedaf, retrieved 2026-09-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).