component
SY6287CABC
Public Made by Adomby adom
Silergy Corp Power Distribution Switches, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSY6287CABC
Silergy Corp · Power Distribution Switches · SOT-23-6
SY6287CABC from Silergy Corp, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input pin, decoupled with a 10µF capacitor to GND; the input operating range is 2.5V to 5.5V. |
| 2 | GND | power_in | Ground pin. |
| 3 | EN | input | ON/OFF control, active high; do not leave it floating. |
| 4 | OCB | output | Open drain fault flag output (asserted low on over-current or over-temperature fault). |
| 5 | ISET | passive | Current limit programming pin; connect a resistor RSET from this pin to ground, with ILIM (A) = 230/RSET (Ω). |
| 6 | OUT | power_out | Output pin, decoupled with a 10µF capacitor to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Silergy Corp |
| Package | SOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IN, OUT voltage (absolute maximum) | 7 | V | 3 | ||||
| ISET, OCB, EN voltage (absolute maximum) | 7 | V | 3 | ||||
| Power dissipation PD | PD | 0.94 | W | TA = 25°C, SOT23-6 (DFN2x2-6 value 1.53 W not used) | 3 | ||
| Junction temperature | 150 | °C | 3 | ||||
| Lead temperature (soldering) | 260 | °C | Soldering, 10 sec. | 3 | |||
| Storage temperature range | -65 | 150 | °C | 3 | |||
| IN, OUT voltage (recommended operating) | 2.5 | 5.5 | V | 3 | |||
| All other pins voltage (recommended operating) | 0 | 5.5 | V | 3 | |||
| Junction temperature range (recommended operating) | -40 | 125 | °C | 3 | |||
| Ambient temperature range (recommended operating) | -40 | 85 | °C | 3 | |||
| Input Voltage Range | VIN | 2.5 | 5.5 | V | 3 | ||
| Shutdown Input Current | ISHDN | 0.1 | 5 | µA | Open load, switch off | 3 | |
| Reverse Leakage Current | 0.1 | 5 | µA | IN tie to GND, VOUT=5V | 3 | ||
| Quiescent Supply Current | IQ | 45 | 100 | µA | Open load, switch on | 3 | |
| FET RDS(ON) | RDS(ON) | 65 | 100 | mΩ | VIN=5V, IOUT=0.5A | 3 | |
| Current Limit Factor | 195.5 | 230 | 264.5 | V | IOUT=0.5A, VOUT=4V (Note 5) | 3 | |
| Current Limit Factor | 212 | 230 | 248 | V | IOUT=1.5A, VOUT=4V (Note 5) | 3 | |
| EN Logic-low Voltage | VIL | 0.4 | V | 3 | |||
| EN Logic-high Voltage | VIH | 1 | V | 3 | |||
| Output Turn On Time | tON | 1 | 2 | 5 | ms | RL=10Ω, CL=1µF. Measure from EN ON to VOUT reach VIN×90% | 3 |
| Output Turn On Rise Time | tR | 1 | 2 | 5 | ms | RL=10Ω, CL=1µF. Measure from VOUT=10% of VIN to 90% of VIN | 3 |
| OCB Leakage Current | ILKG_OCB | 0.01 | 1 | µA | VOCB=5V | 4 | |
| Over Current Flag Response Time | tOCB | 4 | 8 | 12 | µs | VOUT=VIN/2 to FLG low | 4 |
| Current Limit Threshold | ILIM | 425 | 500 | 575 | mA | RSET = 460.0 Ω (Table 1, Operation section) | 8 |
| Current Limit Threshold | ILIM | 1380 | 1500 | 1620 | mA | RSET = 153.3 Ω (Table 1, Operation section) | 8 |
| IN UVLO Threshold | VIN,UVLO | 2.45 | V | 3 | |||
| IN UVLO Hysteresis | VIN,HYS | 0.1 | V | 3 | |||
| EN Input Capacitance | CEN | 1 | pF | Note 4: guaranteed by design, not production tested | 3 | ||
| Output Turn Off Time | tOFF | 22 | µs | RL=10Ω, CL=1µF. Measure from EN OFF to VOUT reach VIN×10% | 3 | ||
| Output Turn Off Fall Time | tF | 21 | µs | RL=10Ω, CL=1µF. Measure from VOUT=90% of VIN to 10% of VIN | 3 | ||
| OCB Low Resistance | ROCB | 9 | Ω | VIN=5V, IL=10µA | 3 | ||
| OCB Low Resistance | ROCB | 12 | Ω | VIN=3.3V, IL=10µA | 3 | ||
| Thermal Shutdown Temperature | TSD | 150 | °C | 4 | |||
| Thermal Shutdown Hysteresis | THYS | 20 | °C | 4 | |||
| Current-limit Response Time | tOC_res | 25 | µs | VOUT=0V (Note 5) | 4 | ||
| Package Thermal Resistance junction-to-ambient | θJA | 106.4 | °C/W | Natural convection, TA = 25°C, Silergy test board (Note 2), SOT23-6 | 3 | ||
| Package Thermal Resistance junction-to-case | θJC | 41.7 | °C/W | Pin 2 is case position (Note 2), SOT23-6 | 3 |
CAD (KiCad official)
- Symbol:
SY6287CABC - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
sy6287cabc-etched.step/sy6287cabc-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sy6287cabc.step/sy6287cabc.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Silergy Corp datasheet (14 pp, sha256
1b9035ac6c6f4b49, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).